Use the CUR004S5401XX when your DDR5 SODIMM socket needs a 5.2 mm stack height and a standard 262-pin interface. CONSHARE builds this socket to the JEDEC-style outline used by laptop, embedded, and edge-computing memory modules, with a latch-open body that stays within a 78.00 mm maximum envelope. The extra vertical clearance over the 4.0H variant gives design teams room for taller DRAM packages, small heatsinks, protective coatings, or structural ribs on the host PCB — without forcing a switch to a non-standard connector family.

When a 5.2 mm Stack Height Becomes the Smarter Choice

Most SODDR5 sockets on the market sit at 4.0 mm. That height works for thin notebooks and standard DIMMs, but it leaves almost no margin when the module itself is taller than average or when the chassis forces components to crowd the memory area. The CUR004S5401XX raises the seating plane to 5.2 mm, adding roughly 1.2 mm of vertical relief where it matters.

Engineers typically specify this height for three reasons:

• Module package clearance — some DDR5 modules carry taller PMICs, capacitor arrays, or thermal pads that can foul a 4.0H socket's latch arms.

• Underfill or conformal coating — boards that go through underfill, potting, or protective coating need extra space around the latch mechanism so the latch still snaps cleanly.

• Structural keep-out zones — ribs, shields, or connector walls on the motherboard often sit close to the socket outline; the 5.2H body buys back clearance without changing the electrical footprint.

Despite the taller body, the contact pitch, pin count, and recommended PCB layout remain standard. You can drop this socket into an existing DDR5 SODIMM design without re-spinning the memory bus routing.

Mechanical Layout That Keeps DDR5 Modules Seated

The socket uses a two-piece metal latch on each end: a fixed bracket and a spring latch that releases when pressed. The drawing specifies a 78.00 mm maximum latch-open length and a 5.20 ± 0.25 mm stack height, dimensioned and toleranced per ASME Y14.5-2009. All unspecified dimensions carry a ±0.15 mm tolerance unless noted otherwise, which is tight enough for high-density pick-and-place lines without driving special inspection fixtures.

Latch Geometry and Board Clearance

The latch arms are stamped from 0.35 mm SUS304 stainless steel and plated matte tin. That combination gives the spring fingers a stable actuation force through thousands of insertion cycles while resisting the solder flux and thermal cycling common in SMT reflow. The latches close over the module edge and create a 1.70 mm minimum flat surface along the board edge, helping automated optical inspection distinguish seated parts from tilted ones.

Solder Tail and Contact Interface

The terminals are phosphor bronze (C5210) at 0.15 mm thickness, with a two-tier finish strategy: the contact area receives gold plating over a 30 µ" minimum nickel underplate, while the solder tail is finished with 100 µ" minimum matte tin over 50 µ" minimum nickel. This split finish balances insertion-wear resistance at the mating interface with excellent solderability at the board.

Materials & Finishes Configured for the Long Haul

CONSHARE does not treat the socket as a plastic body with metal pins. Each sub-component is matched to the stress it sees during assembly and operation.

The LCP housing holds dimensional stability above 260 °C reflow peaks and resists the wicking that can pull solder paste into the contact cavity. Black color is standard; it blends into most motherboard designs and reduces visible light reflection during AOI.

What the Reel Data Tells Procurement

Packaging details are easy to overlook until a line goes down because the carrier tape peeled too hard or the reel arrived unsealed. CONSHARE ships the CUR004S5401XX on 16 mm embossed carrier tape wound on a 330 mm reel. Standard packing is 400 pieces per reel and four reels per carton, giving 1,600 pieces per carton.

Each plate is vacuum packed with two desiccant packs. That matters more than it sounds: phosphor-bronze contacts with matte tin tails can show oxidation or discoloration if they sit in humid warehouse air for weeks. Vacuum packaging keeps the solderability window open through ocean freight and long inventory holds.

CONSHARE Quality & Supply Advantages

CONSHARE builds this socket under the same process controls used for DDR5 UDIMM and PCIe connector families. The drawing references EIA 364-1000 reliability testing, meaning the contact design has been validated against industry-standard mechanical, thermal, and environmental tests when paired with the correct test module and documented test conditions.

Key production controls include:

• Dimensioning per ASME Y14.5-2009 — ensures drawing intent survives translation to mold tooling and stamping dies.

• RoHS and HF compliance — satisfies EU, California, and most OEM green-material requirements.

• Traceable date code — molded into the housing for lot control and failure analysis.

• Sample MOQ and short lead times — standard catalog items ship from existing tooling; custom plating codes or packaging can be quoted separately.
  

Quick Selection Guide: SODDR5 Socket Heights

If you are unsure whether the 5.2H or the 4.0H variant fits your design, use the guide below.

Both variants share the same 262-pin assignment, pitch, and PCB footprint. Switching between them is a mechanical decision, not a signal-integrity redesign.

Typical Applications

The CUR004S5401XX fits anywhere a standard DDR5 SODIMM slot needs extra vertical headroom:

• Industrial PCs and edge servers with tall memory modules

• Medical imaging workstations using conformal-coated boards

• Ruggedized laptops and mobile computing platforms

• Telecom and network appliances with DIMM retention straps or heatsinks

• Embedded systems that route components under or beside the memory socket

FAQ

What does the "STD" in the description mean?

STD indicates the standard 262-pin SODDR5 outline, not a keyed or customized variant. The contact arrangement and module keying follow the conventional DDR5 SODIMM specification.

Is the 5.2H socket electrically different from the 4.0H version?

No. The pin count, pitch, contact assignment, and signal path are the same. Only the housing stack height and related mechanical envelope differ.

Can I use this socket with lead-free solder processes?

Yes. The LCP housing and matte-tin / gold-over-nickel finishes are compatible with standard lead-free reflow profiles.

What plating variations are available?

The drawing supports contact plating codes aligned with common industry practices, including gold-over-nickel and gold-over-palladium-over-nickel systems. Contact CONSHARE with your exact plating code for confirmation.

How is the product protected during shipment?

Each reel is vacuum sealed with desiccant to maintain solderability. Cartons are labeled with date code, quantity, and pull-out direction to reduce feeding errors at the SMT line.

Ordering Information

For samples, CAD models, or a current data sheet, contact CONSHARE with your target module type and annual volume. The engineering team can confirm plating codes, tape-and-reel orientation, and any custom labeling requirements before your first order.

Product Documentation