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Card Edge Connector
Industrial, IT Datacom
DDR5 raised the ceiling on what memory subsystems can do. Data rates jumped past 4800 MT/s and kept climbing. That sounds great on a spec sheet, but it also means the physical link between the module and the board now has to handle signals with tighter timing budgets than most engineers have ever dealt with.
A 262-pin SODIMM slot running DDR5 signals is not just a bigger version of a DDR4 socket. The pin count, the pitch tolerance, and the impedance profile all need to work together in ways that leave almost no room for "good enough."
This is where the CONSHARE CUR002S5401XX fits.
It is a right-angle, surface-mount SO-DIMM socket built for DDR5 notebooks, 1U server blades, embedded boards, and anything that squeezes high-bandwidth memory into a low-profile enclosure. The 4.0 mm seated height keeps the DIMM parallel to the PCB without eating into the Z-height budget that thin-and-light designs depend on.
DDR5 modules push 32 to 40 data bits per sub-channel. At those lane counts and edge rates, the contact geometry inside the socket becomes a real variable in the link budget.
This connector uses a stamped-and-formed phosphor bronze contact with a dual-beam design. Each pin provides two independent wipe points against the module pad. This is not marketing language — it is how you maintain contact resistance below the threshold where a DIMM training sequence fails during boot.
The 15 micro-inch hard gold plating (Au15µ") across the full contact area serves two purposes:
Durability: rated for 25 mating cycles minimum without exposing the nickel underplate. That matters for validation labs, field-replaceable modules, and production line rework where sockets get cycled more often than the OEM intended.
Corrosion resistance: mixed-metal environments (gold-on-tin, gold-on-nickel-barrier) are galvanically active. Thin flash gold wears through fast. 15µ" gives you a real barrier.
Some designers assume a lower socket height is always better. It is not that simple.
At 4.0 mm, this connector keeps the SODIMM parallel to the PCB with enough air gap to:
Let airflow reach components underneath the module
Avoid mechanical interference with tall passives placed near the socket footprint
Maintain a clean mate/demate angle without stressing the module PCB or the SMT solder joints
For notebooks with a total Z-height under 15 mm, this 4.0 mm profile is the difference between a DIMM that fits and a DIMM that scrapes the chassis.
What matters | What CONSHARE delivers |
|---|---|
Contact resistance stability | ≤ 30 mΩ initial, ≤ 10 mΩ drift after environmental stress |
Insulation resistance | ≥ 1,000 MΩ at 500 V DC (not just at ambient — post-condensation test) |
Dielectric withstand | 500 V AC for 1 minute, no flashover |
Solder tail coplanarity | ≤ 0.10 mm across all 262 pins (inspected at final QC, not sampled) |
Retention force | Nominal 3.92 kgf per latch pair, measured on every production batch |
Operating temperature | −55 °C to +85 °C (full range validated, not derated for marketing) |
RoHS / REACH | Full compliance, documentation traceable by batch |
We do not rely on supplier certificates. Every production lot goes through XRF thickness measurement at three points per contact zone. The report ships with the batch if you ask for it.
Yes — within the standard JEDEC module envelope. The latch design accommodates modules up to 1.4 mm total PCB thickness plus label. If your heatsink extends beyond the module outline, we can review the CAD overlay with you.
Standard orders ship in 2–3 weeks. We keep bare housings, pre-stamped contacts, and latch sub-assemblies in running inventory. What takes time is the final assembly and QC sequence, which we do not short-cut.
Yes. The standard ejector is black LCP. You can specify natural, blue, white, or a custom color with a 4-week lead time adder and a minimum lot quantity. This is useful for OEMs who color-code memory slots by channel or by supported speed grade.
The obvious answer is DDR5 notebook platforms — Intel Raptor Lake, Meteor Lake, and AMD Phoenix / Strix Point designs that use socketed SO-DIMM memory instead of LPDDR5X soldered-down.
But we also see demand from less obvious places:
Compact edge servers: 1U and 2U short-depth boxes that run DDR5 UDIMMs on a riser but need a right-angle SO-DIMM socket for out-of-band management modules
Industrial single-board computers: COM Express carriers and proprietary SBCs that value field-upgradeable memory over soldered-down density
Test and validation fixtures: DDR5 interposers and compliance test boards where socket durability and consistent contact resistance matter more than cost
If your use case is not on this list, that does not mean the part will not work. It means we have not seen it yet — and we are happy to help you evaluate it.
Most connector catalogs give you a drawing and a price. That is fine for commodity interconnects. A DDR5 memory socket at 262 positions is not a commodity.
Here is what comes standard when you source this part from CONSHARE:
100% automated optical inspection on every assembled socket before packaging. We check contact alignment, SMT lead coplanarity, and latch function — not on a sample, on every piece.
Batch-level XRF reports for plating thickness, available as PDF or CSV.
Solderability testing per J-STD-002, performed monthly on retained samples from production.
Dedicated engineering support for PCB footprint review. Send us your layout; we will check pad geometry, solder mask clearance, and paste stencil aperture against our recommended land pattern before you spin a board.
Custom packaging options: tape-and-reel, tray with vacuum-sealed moisture barrier, or customer-specified tray orientation. No minimum order surcharge for packaging changes.
Part number: CUR002S5401XX Description: SODDR5, 262-pin, right-angle SMT, 4.0 mm height, standard latch, Au15µ" hard gold, tray packaging
For pricing, samples, or a footprint review, reach out to the CONSHARE sales team with the part number above.
