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Card Edge Connector
Industrial, IT Datacom
DDR5 did not just increase bandwidth. It raised the stakes for every component in the signal path. At 4800 MT/s and beyond, the connector between the UDIMM and the motherboard is no longer a mechanical afterthought—it is a controlled-impedance element that either preserves or degrades the eye diagram your SI team spent weeks optimizing.
Engineers who have chased intermittent contacts, insertion-force drift, or housing warpage after lead-free reflow know the real cost of a "good enough" connector. It does not show up on the BOM as a line item. It shows up in FA reports, RMA tickets, and board respins.
CONSHARE built this 288-pin DDR5 UDIMM series—part numbers CUR001U521146 (Au15u") and CUR001U521147 (Au30u")—to eliminate that uncertainty. The two plating options map to the two reliability profiles memory system architects actually need, without forcing a one-size-fits-all specification that inflates cost for no signal benefit.
A DDR5 UDIMM carries 288 contacts across a single row. That is 288 opportunities for crosstalk, 288 solder joints that must survive thermal cycling, and 288 insertion events that must remain within a repeatable force window across the production life of the program.
The pin field on this connector is tuned to the JEDEC DDR5 module outline. That matters because memory channel routing on modern motherboards is already constrained by DIMM slot placement, CPU package keep-outs, and VRM clearances. A connector that deviates even fractionally from the standard outline forces your PCB layout team to push traces into non-ideal layers or lengthen stub regions. CONSHARE holds the outline and the keying position to the specification so your mechanical and electrical teams are not working against each other.
The integrated mylar layer deserves its own mention. During high-speed pick-and-place, the mylar acts as a lead-in guide and a contact shield. It reduces the chance of pin stubbing on the first insertion, which is the leading cause of contact damage in automated assembly. Fewer stubbed pins means fewer rework stations, less scrap, and a smoother NPI ramp.
PA9T was selected for this housing because it retains dimensional stability across the temperature range where other thermoplastics begin to relax. Standard PBT housings can creep under sustained thermal load in a server chassis. LCP is dimensionally stable but tends to be brittle during snap-fit assembly. PA9T sits in the middle: stiff enough to hold pin alignment through 25+ mating cycles, tough enough to survive the mechanical shock of automated module insertion, and thermally stable enough to keep solder joint stress predictable after reflow.
For memory modules running in 24/7 environments—think edge AI servers, telecom baseband units, or industrial control platforms—this translates to contact resistance that stays flat over time instead of drifting as the housing relaxes and contact normal force drops.
The black extractor on this series uses a PA9T grade with higher carbon filler content than the standard natural resin. That improves stiffness and UV resistance during extended storage under fluorescent warehouse lighting. In tray-fed SMT lines where modules may sit in the feeder for hours before placement, that small material detail prevents brittle failure during the extraction stroke. It is not a cosmetic decision. It is a decision that keeps your line running.
Most connector vendors offer one plating thickness and expect you to absorb the cost of over-specification. CONSHARE offers two because your reliability target and your cost target are rarely the same program.
Spec | CUR001U521146 (Au15u") | CUR001U521147 (Au30u") |
|---|---|---|
Best Fit For | Single-insertion systems: consumer desktops, embedded edge nodes, digital signage | Multi-insertion or high-reliability systems: datacenter servers, test fixtures, field-serviceable chassis |
Contact Resistance | ≤ 40 mΩ initial | ≤ 40 mΩ initial |
Durability | ≥ 25 mating cycles | ≥ 25 mating cycles |
Wear Margin | Standard | 2× gold volume for fretting resistance and repeated insertion |
Dielectric Strength | 500 V AC / 1 min | 500 V AC / 1 min |
Current Rating | 0.75 A per contact | 0.75 A per contact |
Au15u" is the rational choice when the UDIMM is inserted once during factory assembly and never touched again. It delivers the contact resistance and corrosion protection required for a normal product life, without the premium of gold you will never wear through.
Au30u" is the conservative engineering choice when the module sees repeated insertion—during burn-in, during field upgrades, or in test-bay environments where modules are swapped daily. Thicker gold gives you a larger wear buffer before contact resistance begins to climb, and it provides better fretting corrosion resistance in high-vibration chassis.
If your team is unsure which way to go, the rule of thumb is simple: if a human will touch the module more than twice after it leaves the factory, specify Au30u".
This series is molded from halogen-free PA9T resin with full RoHS compliance. That is not a marketing checkbox—it is a gate for any board shipping into the EU, Korea, Japan, or any OEM with a green procurement policy. CONSHARE maintains lot traceability on resin batches and plating chemistry, so when your compliance team asks for supporting documentation, the certificate already exists.
The stamping line runs 100% CCD inspection on contact pitch and coplanarity after forming. Bent pins are removed at the source, not discovered during your incoming IQC. Sample lots from each production run go through insertion-force validation and contact resistance testing before tray packing. If a cavity starts to drift, we catch it on the line, not in your SMT room.
The connector is rated for −40°C to +105°C operation, which covers industrial and automotive-adjacent applications that push beyond standard commercial temperature ranges. The 500 V AC dielectric withstand and 1000 MΩ minimum insulation resistance provide adequate margin for the low-voltage DDR5 signaling environment while leaving headroom for unexpected transient events.
Shipping connectors loose in a bag is the fastest way to turn a precision-stamped contact into a bent pin. CONSHARE ships this series in hard trays with paper board separators and sponge cushion—324 pieces per tray, 10 trays per carton, for a standard carton quantity of 320 pieces. The tray geometry follows JEDS standards, which means it interfaces directly with most automated tray feeders and vacuum pick-up tooling without mechanical adapters.
Standard lead time is 4–6 weeks ARO for both Au15u" and Au30u" variants. No tiered MOQ games. If your forecast is stable, we can hold buffer stock under a VMI arrangement to compress your receiving cycle.
Customization is available on the same platform. The housing can be tooled in white (position 2), and the extractor is available in white or blue if your chassis requires color-coded insertion orientation. These variants run on the same mold base without a full drawing cycle, so lead time for a custom color typically adds one week, not six.
Parameter | Value |
|---|---|
Product Type | DDR5 288-Pin UDIMM Connector |
Housing Material | PA9T, Black |
Extractor Color | Black |
Contact Plating | Au15u" or Au30u" over Nickel |
Current Rating | 0.75 A max per contact |
Voltage Rating | 30 V AC max |
Insulation Resistance | ≥ 1000 MΩ |
Dielectric Withstand | 500 V AC for 1 minute |
Mating Cycles | ≥ 25 |
Operating Temperature | −40°C to +105°C |
Environmental Compliance | RoHS, Halogen Free (HF) |
Standard Packaging | Hard Tray, 324 pcs/tray; 10 trays/carton |
A: Au15u" is acceptable if the UDIMM is inserted once at assembly and left in place. If the system is designed for field service, memory upgrades, or burn-in cycling, Au30u" is the safer specification. The 30u" variant is also the better choice for chassis subject to vibration or thermal cycling that can induce micro-motion at the contact interface.
A: Yes. The glass transition temperature of this PA9T grade is well above typical SAC305 peak reflow temperatures. You will not see housing distortion or terminal float during normal assembly.
A: Hard tray is standard for this series because the 288-pin body length is better supported in a rigid tray than on a flexible carrier tape. If your process absolutely requires tape-and-reel, contact CONSHARE with your annual volume. We can evaluate a reel package for programs above a stable volume threshold.
A: Yes. Both variants ship from the same production line and can be combined on a single order. The part numbers are CUR001U521146 for Au15u" and CUR001U521147 for Au30u". Just split your line quantities accordingly.
A: The connector follows the JEDEC DDR5 UDIMM outline and keying specification. If your module is built to the same JEDEC outline, mechanical compatibility is guaranteed. For electrical validation, CONSHARE provides contact resistance and insertion-force test reports on request.