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Card Edge Connector
Industrial, IT Datacom
DDR5 memory modules run faster and draw less power than DDR4, but they also punish connectors harder. The CUR003H52RSXX is a 262-pin reverse (RVS) SODIMM socket built for designs where board space is tight, height is restricted, and signal integrity still matters. With a 5.2 mm above-board profile and a contact system matched to DDR5 module edge requirements, it gives notebook, embedded, and compact workstation boards a reliable mating surface without forcing a taller layout.
This socket carries the full 262-pin DDR5 SODIMM footprint. The 0.50 mm pitch matches the JEDEC spacing used by standard DDR5 module edges, so the PCB footprint lines up without forcing you into a non-standard breakout pattern. Engineers keep the full pin count and routing flexibility.
The 5.2H stacking keeps the assembled module close to the board. That matters when the target device has a shallow chassis, a heatsink sitting directly above the memory, or a fixed card cage clearance. You gain the density and serviceability of a SODIMM without the height penalty that often pushes designers toward soldered-down memory packages.
RVS orientation swaps the keying position relative to standard SODIMM sockets. If your routing fan-out or mechanical keep-out works better with the module notch on the opposite side, this part lets you keep the same DDR5 module while simplifying the PCB layout.
The terminal uses C5210 copper alloy with selective gold plating concentrated on the solder tail zone, over a nickel underplate. Gold resists oxidation during reflow and storage, which means fewer cold joints and better wetting when the socket is soldered to the board. The nickel layer underneath acts as a diffusion barrier, so the finish stays stable across repeated thermal cycling.
The housing is molded from LCP rated UL 94V-0. It holds dimensional stability at reflow temperatures and does not soften enough to let contacts shift during automated assembly. The black resin also blends visually with most PCBs — a small but real plus for consumer boards where the connector is visible.
The part is marked HF and RoHS compliant. For products shipping into regions with restricted substance rules, that removes one more qualification hurdle from the BOM.
The solder peg areas are designed for a 0.12 mm minimum stencil thickness. Thinner stencils can starve the joint; thicker stencils help the pegs form solid fillets on the first pass. If your SMT line already runs 0.13–0.15 mm stencils for other connectors, this socket drops in without a process change.
CONSHARE ships the CUR003H52RSXX at 400 pieces per reel and 1,600 pieces per carton. Each inner package is vacuum-sealed with desiccant, which matters more than it sounds for gold-plated contacts in humid climates or during long sea freight. Oxidation on contact surfaces is one of the quieter causes of field failures, and the packaging is designed to push that risk out past the assembly window.
Choose the CUR003H52RSXX when:
You need DDR5 SODIMM upgradability in a chassis with less than 6 mm clearance above the PCB.
The routing or mechanical layout favors reverse-keyed memory sockets.
You want a soldered socket rather than a press-fit or mezzanine solution.
Your assembly line is already optimized for 0.12–0.15 mm stencils and standard tape-and-reel feeding.
It is not the right fit if you need a standard-key SODIMM, a taller 9.2 mm socket for easier finger access, or a connector rated for frequent consumer-inserted modules beyond the specified mating cycles.
Attribute | Value |
|---|---|
Product type | DDR5 SODIMM socket, reverse orientation |
Pin count | 262 |
Module pitch | 0.50 mm |
Above-board height | 5.2 mm |
Housing material | LCP, UL 94V-0, black |
Terminal material | C5210 copper alloy |
Contact finish | Selective gold over nickel underplate |
Halogen-free / RoHS | Yes / Yes |
Packaging | 400 pcs/reel, 1,600 pcs/carton, vacuum-sealed |
Recommended stencil | ≥ 0.12 mm |
RVS stands for reverse orientation. The keying notch is positioned opposite to a standard SODIMM socket, which can simplify routing or mechanical clearances on certain board layouts.
No. The 262-pin count and keying are specific to DDR5. DDR4 SODIMM modules use a different pin count and key position, so they will not seat correctly.
Yes. We can tailor gold thickness, reel quantity, and inner packaging upon request for volume orders. Contact our sales team with your qualification requirements and forecast.
Dimensional tolerances follow ASME Y14.5-2009 unless otherwise noted on the drawing. Contact resistance, insertion/withdrawal force, and environmental testing align with EIA-364 industry practice.
