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Board to Board Connector
Industrial, IT Datacom
Stack two boards on a BTB and you are managing three error sources at once: board thickness, paste volume, and placement. Add them up and you land somewhere between 0.3 and 0.5 mm per side. A fixed BTB gives you nothing back on that budget. Any lateral offset rides the contacts up the chamfer, normal force falls off, and the joint either runs warm or never fully seats.
Here the contact housing moves inside the shroud instead, so the connector eats the offset rather than passing it into your solder joints.
The 0.80 mm pitch AAC8M060G2068R1 (60P, 2 x 30) and AAC8M080G2068R1 (80P, 2 x 40) are vertical SMT male headers with a 6.80 mm plastic body, built to mate with the matching floating socket. 6.80 mm covers the middle of the range most people actually build: camera boards, sensor stacks, anything modular that needs 6 to 12 mm between the boards. LCP housing, rated -40 to +125 °C, so under-hood automotive, outdoor signage, and industrial sensor heads are all in range.
H1 is your plug body height. H2 is the socket body you pair it with. H3 is the finished board spacing. Only two socket bodies exist, so six combinations come out of three plug heights.
Mated stack | Plug H1 | Socket H2 |
|---|---|---|
6.50 mm | 4.80 | 4.90 |
8.00 mm | 6.80 | 4.90 |
9.00 mm | 7.80 | 4.90 |
9.75 mm | 4.80 | 8.30 |
11.75 mm | 6.80 | 8.30 |
12.75 mm | 7.80 | 8.30 |
Plastic height is encoded 048 (4.80 mm), 068 (6.80 mm), or 078 (7.80 mm), and both of your part numbers are 068. That puts you at 8.00 mm of board spacing with a 4.90 mm socket, or 11.75 mm with an 8.30 mm socket. Going from 8 mm to 12 mm means changing one socket, not re-qualifying a second plug.
With n as positions per row:
A, overall length = 0.80n + 4.34 mm
B, width across the contact field = 0.80n + 2.40 mm
C, pin 1 to last pin centre-to-centre = 0.80(n - 1) mm
The 4.34 and the 2.40 are end-wall and shroud allowances. They stay put.
Your 60P part measures 28.34 x 26.40 mm with a 23.20 mm active span. The 80P is 36.34 x 34.40 mm with 31.20 mm. Nothing else about the land pattern changes, so a mid-project pin count change usually does not force a new stencil.
Code | Gold in contact area | Mating cycles it will hold up to |
|---|---|---|
G0 | Gold flash | One mate, prototypes |
G2 | 3 u" | Around 30 |
G4 | 10 u" | 100 to 300 |
G6 | 30 u" | Several hundred, field service |
G2 is what both of your codes carry and it is the right call for boards mated once on the line. If the product gets opened in the field or sits in a test fixture, move to G4 or G6 before you start seeing resistance drift. G1, G3, and G5 cover 1, 5, and 15 u" if you need something in between.
Tails carry gold flash over 50 u" nickel underplate. The two ground tabs at each end are brass, 80 u" matte tin over 50 u" nickel. That matte tin is what keeps solder from wicking up the contact during reflow.
Run 0.5 A through a 120 mΩ pair and you lose 60 mV at the joint, about 30 mW of heat. On a 3.3 V rail that is under 2 percent. On a 1.0 V core rail it is 6, and that is worth planning around.
50 V is a withstand number, not a working voltage, so keep headroom if anything inductive is switching across it. The 500 MΩ insulation floor is what stops adjacent lines coupling when your node impedance is high, which matters far more on an analog front end than on a digital bus.
Floating contacts need a longer mechanical path, and that shows up as roughly 40 mΩ over a fixed BTB at the same pitch. Digital buses never notice. A bandgap reference or a current-sense line will.
A sensor PCB dropping into a milled pocket gives you ±0.3 mm on the pocket and another ±0.1 mm on the sensor housing. With a fixed BTB that stack has to be fixtured out. With this one the mounting screws pull the boards into alignment as they close.
Driver boards plugging into a long backplane inherit every bit of the wave-solder fixture's positional error. The float takes that out, so boards stop binding partway through insertion.
The two alignment posts are Ø0.60 mm and carry most of the lateral load. Give them Ø0.65 to Ø0.70 mm non-plated holes at ±0.05 mm position. The Ø2.00 mm tabs handle reflow strain and shear, and want plating so a fillet forms.
Do not mask-define the contact pads. Squeegee pressure varies across the board, and 0.05 mm of lift at one end is enough to lock the float before the boards ever meet.
Keep paste volume even from end to end. Ten percent mismatch across a 36 mm body tilts the part during reflow, which is why aperture design and step stencils matter more here than on a fixed connector.
Leave the ground pads at full size. Those two end plates take the shear load and act as strain relief for the floating mechanism, and they are the only thing holding the connector flat under vibration.
You are paying for roughly 40 mΩ and a higher piece price. Skip it when board spacing is already nailed down by something else, a heatsink, an optical bench, a shroud. Skip it on precision analog where that 40 mΩ lands in your measurement. Skip it when the boards mate once and you are jigging them anyway. And skip it in sustained high vibration with no secondary lock, because a floating contact can lose normal force where a staked fixed part will not.
CONSHARE stocks the 60P (AAC8M060G2068R1) and 80P (AAC8M080G2068R1) codes in tape-and-reel with G2 as the standard finish. Per lot we run XRF on plating thickness, sample contact resistance on a 0.5 A bench, and cycle the floating mechanism mechanically. Not per shipment, per lot.
Stocked codes ship in 2 to 3 weeks, faster for sample reels on an engineering build. We can move plating up to G6, switch the body to 4.80 or 7.80 mm, tool a pin count outside the stocked grid, or pack in trays for low-volume runs.
A fixed BTB locks the contact housing to the shroud. Ours lets it move sideways instead, which is what absorbs your stack-up error. The cost is a longer contact path, so the resistance ceiling is 120 mΩ rather than the 80 mΩ you would see on a fixed part.
Yes. The 4.90 mm socket gives you 8.00 mm of board spacing, the 8.30 mm gives 11.75 mm. Same plug and same footprint either way, so you carry one plug and pick the socket per build.
LCP holds its shape through a 245 to 260 °C peak with 60 s above 217 °C, and the end ground plates carry the strain. The float itself is mechanical and only moves when the boards mate, so reflow never touches it.
