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Board to Board Connector
Industrial, IT Datacom
Board-to-board sockets earn their place by removing a harness, four standoffs and an assembly step. This page covers four 0.80 mm pitch, dual-row, vertical surface-mount sockets from CONSHARE: AA3F040S1050R with 40 contacts, AA3F050S1050R with 50, AA3F080S1100R with 80, and AA3F100S2050R with 100. Three stand 5.00 mm above the PCB. All four share one pad geometry, so the row grid and pad sizes stay put even when the contact count changes.
Ask two questions before anything else: how many contacts does the interface need, and how far apart must the two boards sit. Everything follows from those answers.
Part number | Contacts | Rows | Finish in the contact area | Body height above PCB | Overall length |
|---|---|---|---|---|---|
AA3F040S1050R | 40 | 2 x 20 | 1 µin gold over nickel | 5.00 mm | 23.30 mm |
AA3F050S1050R | 50 | 2 x 25 | 1 µin gold over nickel | 5.00 mm | 27.30 mm |
AA3F080S1100R | 80 | 2 x 40 | Selective gold over nickel, thickness per order code | 10.00 mm | 39.30 mm |
AA3F100S2050R | 100 | 2 x 50 | 3 µin gold over nickel | 5.00 mm | 47.30 mm |
Contact finishes outside these four run from gold flash up to 30 µin, and 6.00 mm bodies are also available. Packing for every size here is tape and reel.
Overall length follows one expression: 0.80 mm multiplied by the positions per row, plus 7.30 mm. A 2 x 20 measures 23.30 mm end to end and a 2 x 50 measures 47.30 mm. Centre-to-centre span across a row is 0.80 mm multiplied by the positions per row minus one, giving 15.20 mm and 39.20 mm for the same two sizes. Put both expressions in your PCB notes and moving between sizes later becomes a dimension edit rather than a new layout cycle.
Three of the four sit at 5.00 mm. That works when nothing under the mating area is taller than small passives and the upper board can come down close. The 80-contact version uses a 10.00 mm body, buying space for taller parts, a stiffener, or airflow between the two boards. Height is ordered independently of contact count, so revisiting it calls for no pad changes.
A polyimide tape covers the mating face so a vacuum nozzle can place the part, and it comes off after reflow. Build that removal into the process. If another component goes down over the socket first, the tape turns into waste at the wrong moment in the line.
Contacts are copper alloy. Gold sits only in the contact area. Matte tin goes on the solder tails so they wet properly in a lead-free profile, and nickel under both layers keeps tin from migrating while giving the gold a hard base. Nothing is plated where it does no work, which is why a socket at this pitch stays affordable.
What the joint has to survive | Finish worth specifying | Reason |
|---|---|---|
Mated once or twice, sealed enclosure, dry indoor use | 1 µin gold over nickel | Noble enough for a handful of cycles at the lowest gold content |
Occasional opening, service visits, humid or dirty air | 3 µin gold over nickel | More gold left after repeated wipe before nickel is exposed |
Short design life, gentle handling, hard cost target | Gold flash over nickel | Cheapest noble finish on the same contact design |
Over-specifying thickness is the most common way this connector gets expensive for no gain. Match the number to the number of mating cycles the product will genuinely see.
Every contact is rated at 0.5 A, on the assumption that heat can leave through the PCB and the surrounding pins. Where a net needs more, spread it. Three pins sharing 1.2 A stay cooler than one pin carrying the same current alone, and the hottest pin decides how much derating you need.
Allow 80 mΩ maximum per mated contact pair. At 0.5 A that costs roughly 40 mV and dissipates about 20 mW in the joint. A signal going through the socket and back out again loses close to 80 mV, which is small against a 1.8 V or 3.3 V rail and is why this class works for logic-level signalling.
Working voltage is 50 V AC/DC, production tested at 200 V AC for one minute, with insulation resistance of at least 500 MΩ. Operation is specified from minus 40 to plus 105 degrees Celsius. Both figures suit logic boards and bus rails. Neither suits anything connected to mains.
The housing is LCP rated UL94 V-0, so it takes a lead-free reflow profile without softening, and black is standard.
Pay attention to the shield pads. The ground plate is brass with tin over nickel, and it does three jobs at once: it ties the shield to board ground, holds the part flat while the solder is liquid, and gives return currents a low-impedance path. Undersizing those pads produces coplanarity complaints that look like a connector defect and are not.
Mezzanine joints fail from board strain more often than from the connector. Add support points so the mated pair is not carrying chassis load into the solder fillets.
These show up in handheld units linking a main board to a display or sensor board, industrial controllers with a compute module sitting on an IO baseboard, gateways stacking a radio module above the host, and measurement equipment using a mezzanine card. Counts above 60 contacts usually mean the design wants a parallel bus or a wide display interface rather than a couple of serial links.
Walk away if any of these apply: more than half an amp on a single net; boards that cannot be positioned accurately enough and need float to absorb misalignment; an interface plugged and unplugged daily in the field; working voltage above 50 V; or a right-angle mating direction instead of vertical. A floating design, a power-oriented family, or a wire-to-board approach beats this part in each of those jobs.
Production lots go out with plating thickness verified against the ordered finish code, sample testing of contact resistance and dielectric strength, inspection of tail coplanarity, and packing that keeps mating faces from touching each other in transit.
Tooling already exists for the sizes on this page and for the rest of the range, from 2 x 5 through 2 x 70 positions. A repeat order therefore skips the mold-making queue entirely, and quotes are given against capacity we can actually hold rather than a catalogue promise.
Beyond the four stocked codes: any contact count from 10 to 140, gold from flash to 30 µin, body heights of 5.00, 6.00 or 10.00 mm, and reel packing arranged to your feeder specification. Send us the finished stack height you need and we will name the mating plug as well, so the pair arrives matched.
Pad widths and the row grid are identical, but the outline grows 0.80 mm per added position per row. Lay the pad array out so it extends cleanly and keep the shield pads the same across every size.
Tell us the finished stack height. Mated height is the sum of the two halves and CONSHARE supplies both, so a quoted pair removes the guessing and any risk of buying a socket with no matching plug.
Gold flash suits a product mated a few times and then sealed. Move to 1 µin when the enclosure gets opened occasionally, and to 3 µin where field service or humid air is expected.
They handle board-to-board signal reliably at logic levels. For multi-gigabit rates, share the data rate with us and we will go through pin assignment, how many grounds to interleave, and what the return path in your stackup needs.
Yes. Evaluation quantities ship ahead of production, and standard sizes move from sample to reel without re-tooling.
