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Card Edge Connector
Industrial, IT Datacom
This CONSHARE connector is a 40-position, dual-row board-to-board header built for vertical SMT assembly with a 10.0 mm mated stack height. The 0.8 mm pitch keeps the footprint tight, while 1 µ'' gold-on-contact plating gives a stable, low-resistance interface for signal paths that must survive repeated assembly and thermal cycling.
Board-to-board connectors are rarely the star of the design, but they decide whether a two-board system actually ships. This male 40-pin header targets the narrow space between a main board and a daughterboard, mezzanine card, or sensor module where a taller stack-up would force a wider enclosure.
The 0.8 mm pitch places 40 circuits across a length of just under 40 mm. For a 2 × 20 arrangement, that is enough lanes for power, low-speed control, and mid-rate data without forcing the designer to jump to a fine-pitch part that demands more expensive PCB tolerances. At 10.0 mm mated height, it suits common mid-profile chassis: not as slim as a 4.5 mm connector, not as tall as the 15–20 mm variants used for large stand-off boards.
SMT terminations keep the connector on the same side as the rest of the component population, so reflow can run in a single pass. That matters when the underside of the board is reserved for keep-outs, thermal pads, or no-go areas.
A two-row pin field also leaves a continuous ground return path between lanes, so adjacent signal pairs stay quiet without paying for shielded or coaxial routing. For most control and sensor links, that is the difference between a clean first power-on and a board that needs a respin.
Feature | What It Means for the Buyer |
|---|---|
0.8 mm pitch, 2 × 20 positions | 40 signals in roughly 39 mm length; fits compact mezzanine or module-to-mainboard links |
10.0 mm mated stack height | Standard mid-profile spacing; works with common stand-off and spacer inventories |
Vertical SMT termination | Single-pass reflow, no through-hole soldering or back-side rework |
Contact area: 1 µ'' gold over 80 µ'' nickel | Corrosion-resistant mating surface, stable contact resistance across the rated life |
Solder area: matte tin over 50 µ'' nickel | Good wetting with lead-free paste and easy joint inspection |
LCP black housing, UL94V-0 | Keeps shape during reflow, self-extinguishing for safety-regulated equipment |
Rated 0.5 A / 50 V AC/DC | Covers typical signal and low-power rails in industrial, medical, and test gear |
−40 °C to +105 °C operating range | Survives automotive cabin, outdoor enclosure, and factory-floor temperature swings |
Tape-and-reel packaging | Direct feed to pick-and-place equipment without repackaging |
CONSHARE runs these headers on dedicated 0.8 mm BTB tooling with cavity dimensions and plating thickness controlled per lot. The result is a connector that seats predictably in the female socket batch after batch, which cuts the "sometimes it fits, sometimes it doesn't" risk that slows final assembly.
The same family covers multiple pin counts, gold thicknesses, and stack heights. Common requests include switching from 1 µ'' to 3 µ'' or 5 µ'' gold for harsher environments, choosing a 4.5 mm or 8.5 mm stack for slimmer or deeper enclosures, and adding polarization features or modified tape-and-reel pitch for automated lines.
Standard configurations are kept on a rolling production schedule. For prototypes and small-volume builds, CONSHARE can ship sample lots without forcing the buyer into a full-reel minimum, which keeps NPI spending tied to real test needs rather than distributor MOQs. For volume ramps, reel quantities are packed to match the placement machine lane count.
This is the right part when:
The PCB pair needs 40 or fewer signals and the board area is limited.
The target stack height is close to 10 mm after board thickness and stand-offs are counted.
The assembly process is fully SMT and single-sided reflow is preferred.
The environment stays within −40 °C to +105 °C and the circuits carry signal or low-current power.
One common fit is a handheld measurement device where a sensor daughterboard stacks above the main PCB; the 10.0 mm gap clears the tallest component on the lower board while keeping the enclosure slim. Other typical fits include compact industrial controllers, portable medical instruments, communication sub-cards, and automotive interior modules.
Avoid this header if:
The current per pin must exceed 0.5 A continuously. High-current rails need larger contacts or a dedicated power connector.
The system needs hot-swap or frequent mating cycles beyond the typical board-to-board join/disconnect life.
The stack height is much shorter or taller than 10.0 mm. CONSHARE stocks alternative heights in the same footprint.
The board is exposed to strong vibration without additional mechanical retention. Consider adding board locks, screws, or a shrouded variant.
The contact area carries 1 microinch of gold over a nickel underplate. That is enough to prevent base-metal oxidation on low-cycle signal interfaces while keeping the part cost lower than thicker 5 µ'' or 15 µ'' gold options.
The listing covers the male header only. CONSHARE supplies matching female receptacles in the same 0.8 mm pitch family; quote both together to guarantee the exact mated height and polarization.
Tape-and-reel is standard for automated assembly. For manual prototype builds, smaller quantities can be supplied on cut tape or in resealable packs on request.
Yes. The matte tin finish is specified for lead-free reflow and provides a visible, inspectable fillet after soldering.
Use a standard lead-free SMT profile suited to an LCP-bodied connector. Keep the peak zone above 217 °C within the part's tolerance and limit total time above liquidus so the gold and tin finishes are not overstressed.
Add your PCB thickness, spacer or stand-off height, and any allowable tolerance. The 10.0 mm dimension is the centerline-to-centerline mated distance; the actual mechanical stack depends on board thickness and fastener choice.
