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Card Edge Connector
Industrial, IT Datacom
The PCIe 4.0 164‑pin SMT connector is a surface‑mount card edge solution purpose‑built for x16 PCI Express expansion slots in next‑generation computing platforms. Supporting the PCIe 4.0 protocol with 16 GT/s data rates per lane, this connector delivers the bandwidth and signal integrity required for high‑performance servers, AI acceleration hardware, industrial computers, and enterprise storage systems.
CONSHARE has engineered this connector with a side slot‑free, overhang‑free housing design—a structural choice that directly impacts PCB layout efficiency, mechanical stability, and long‑term reliability in dense system environments. With 164 positions arranged in a dual‑row configuration at 1.0 mm pitch, the connector supports the full x16 link width defined by the PCI‑SIG CEM specification.
The 15 microinch gold plating on the contact mating area provides robust corrosion resistance and maintains stable contact resistance across the connector’s operational life—a critical factor for systems requiring consistent electrical performance under varying environmental conditions.
Most PCIe card edge connectors incorporate side openings or housing overhangs as part of their standard design. While these features simplify certain manufacturing processes, they introduce trade‑offs in board space utilization and mechanical robustness.
CONSHARE’s side slot‑free and overhang‑free configuration eliminates these structural protrusions, delivering three tangible benefits:
Maximized PCB Real Estate – The absence of side slots and housing overhangs allows for tighter component placement around the connector footprint. For dense server motherboards and add‑in card designs where every millimeter counts, this design freedom translates into more efficient layout and potentially reduced board layers.
Enhanced Mechanical Stability – A continuous, uninterrupted housing profile provides greater structural rigidity. During card insertion and extraction, the connector body better resists torsional stress—a common failure mode in systems subjected to frequent card swaps or high‑vibration environments such as telecom racks and industrial equipment.
Simplified Solder Joint Inspection – The clean housing profile offers unobstructed visual access to solder fillets, facilitating automated optical inspection (AOI) and manual quality verification during production.
The 15 microinch gold plating over a nickel underplate on copper alloy contacts is not merely a specification—it is a deliberate engineering choice. This plating thickness sits in the "sweet spot" for PCIe card edge connectors:
Corrosion Resistance – 15μ″ of gold provides sufficient barrier protection against oxidation and atmospheric contaminants, ensuring that contact resistance remains within specification even after extended storage or operation in non‑hermetic environments.
Wear Tolerance – The plating thickness directly influences the connector’s 50‑cycle durability rating. At 15μ″, the gold layer withstands repeated mating cycles without exposing the underlying nickel or copper—preserving low contact resistance throughout the connector’s service life.
Cost‑Effective Reliability – While 30μ″ plating offers additional margin for extreme cycling applications, 15μ″ delivers optimal value for the vast majority of computing and server applications, providing reliable performance without unnecessary cost premium.
Surface‑mount termination enables fully automated PCB assembly, reducing manufacturing cycle times and labor costs compared to through‑hole alternatives. The connector is qualified for reflow soldering at 260°C for 3–5 seconds, compatible with standard lead‑free solder profiles used in high‑volume electronics manufacturing.
With a recommended stencil thickness of 0.15 mm, the SMT pads are optimized for consistent solder paste deposition—minimizing voiding and ensuring reliable solder joint formation across the full 164‑pin array.
Contact Resistance – Initial contact resistance of ≤30 mΩ, with a post‑test limit of ≤50 mΩ. This specification ensures that signal attenuation across the connector interface remains minimal—a critical requirement for PCIe 4.0’s 16 GT/s signaling where even small impedance discontinuities can degrade signal integrity.
Insulation Resistance ≥1000 MΩ – High insulation resistance between adjacent contacts minimizes leakage current, reducing the risk of crosstalk and signal coupling in high‑density pin arrangements.
Withstand Voltage ≥500V AC – This rating provides a safety margin for transient voltage events, ensuring the connector maintains electrical isolation under fault conditions or during hot‑swap operations.
Current Rating 1.1A – Each contact supports up to 1.1A of continuous current. For an x16 link with 164 contacts, this aggregate current capacity supports the power delivery requirements of high‑performance PCIe cards without excessive temperature rise at the connector interface.
The following drawing provides the recommended PCB footprint and overall connector outline, essential for accurate motherboard layout.
The cross-section drawing below illustrates the card insertion depth and the vertical clearance required for adjacent components.
This drawing defines the total connector height above the PCB, the position of pin ‘H’, and the correct I/O panel alignment – all critical for mechanical enclosure design.
Insertion Force ≤1.15N per pair – Low insertion force reduces the mechanical stress on both the connector and the PCB during card installation. This is particularly important in high‑density systems where multiple connectors are populated on a single board, as cumulative insertion forces can otherwise risk board flexure or solder joint damage.
Extraction Force ≥0.15N per pair – Sufficient retention force ensures that the card remains securely seated under vibration and thermal cycling—common operating conditions in server and industrial environments.
Contact Retention Force ≥3.43N – This specification ensures that individual contacts remain securely anchored in the housing. Insufficient retention force can lead to contact push‑out during mating, resulting in intermittent connections or complete signal loss.
Operating Temperature: -40°C to +105°C – The wide temperature range accommodates deployment in diverse environments, from cold‑start conditions in outdoor telecom cabinets to elevated temperatures inside densely packed server chassis. The housing material—typically liquid crystal polymer (LCP) or high‑temperature thermoplastic—maintains dimensional stability across this range, preventing warpage that could compromise solder joint reliability.
RoHS & HF Compliant – The connector is manufactured with materials that comply with EU RoHS environmental requirements and are halogen‑free (HF). This ensures regulatory compliance for products destined for global markets and supports corporate sustainability initiatives.
High‑Performance Computing & Servers – The connector is ideal for PCIe expansion slots in rack‑mount and tower servers, supporting GPU accelerators, network interface cards, RAID controllers, and FPGA‑based compute cards. The 16 GT/s data rate enables full utilization of PCIe 4.0 bandwidth for data‑intensive workloads.
AI & Machine Learning Accelerators – AI training and inference systems rely on high‑bandwidth interconnects between GPUs and host processors. The connector’s signal integrity characteristics support the high‑speed data transfers required for large‑scale neural network operations.
Industrial Computers & Embedded Systems – The wide operating temperature range and robust mechanical design make the connector suitable for industrial PCs, automation controllers, and embedded computing platforms deployed in factory and outdoor environments.
Enterprise Storage & Networking – Storage arrays, network appliances, and telecom equipment benefit from the connector’s reliable electrical performance and mechanical durability, supporting 24/7 operation in mission‑critical infrastructure.
Consumer & Commercial Electronics – Desktop motherboards, gaming systems, and commercial‑grade computing devices leverage the connector’s cost‑effective reliability for standard PCIe expansion requirements.
CONSHARE brings two decades of precision connector technology expertise to every product. With a technical team and 54 sets of precision processing equipment, the company maintains rigorous quality control across the entire manufacturing chain—from raw material procurement through finished product delivery.
The connector is produced under ISO9001:2015 certified quality management systems, ensuring consistent dimensional accuracy, plating quality, and mechanical performance across production lots. Each batch undergoes electrical and mechanical verification to confirm compliance with specified performance criteria.
CONSHARE also offers comprehensive customization support, including appearance customization (color, LOGO, model marking), packaging options (anti‑static, bulk, export packaging), and technical assistance with 2D/3D drawings and performance testing.
Parameter | Value |
|---|---|
PCIe Generation | Gen 4 |
Link Width | x16 |
Number of Positions | 164 |
Mounting Type | SMT (Surface Mount) |
Orientation | Vertical |
Pitch | 1.0 mm |
Contact Plating | Au 15μ″ over Ni underplate |
Housing Design | Side slot‑free, overhang‑free |
Housing Material | LCP / High‑Temp Thermoplastic |
Housing Color | Black |
Contact Material | Copper Alloy |
Flammability Rating | UL 94V‑0 |
Current Rating | 1.1A per contact |
Withstand Voltage | ≥500V AC |
Insulation Resistance | ≥1000 MΩ |
Durability | 50 cycles |
Operating Temperature | -40°C to +105°C |
Reflow Soldering | 260°C, 3–5 seconds |
Recommended Stencil Thickness | 0.15 mm |
RoHS / HF Compliance | Yes |
Packaging | Tray / Reel |
A: This design eliminates structural protrusions that can interfere with adjacent component placement on dense PCBs. It also provides greater mechanical rigidity during card insertion and extraction, reducing the risk of housing deformation or solder joint stress. Additionally, the clean housing profile simplifies automated optical inspection of solder joints.
A: 15μ″ gold plating provides excellent corrosion resistance and wear tolerance for most computing and server applications. While 30μ″ offers additional margin for extreme cycling scenarios, 15μ″ delivers cost‑effective reliability for standard PCIe 4.0 deployments—balancing performance requirements with bill‑of‑materials optimization.
A: The connector is designed for standard PCB thickness of 1.57 mm (0.062″), which is the industry‑standard thickness for PCIe add‑in cards and server motherboards.
A: The connector is physically and electrically compatible with PCIe 3.0 systems and will operate at lower data rates without issue. For PCIe 5.0 applications, signal integrity performance at 32 GT/s should be verified through system‑level testing, as the connector is optimized for Gen 4 specifications.
A: Reflow soldering at a peak temperature of 260°C for 3 to 5 seconds is recommended, with a stencil thickness of 0.15 mm for optimal solder paste deposition.
A: Yes, the connector is available in both tray and reel packaging options to accommodate different production line requirements.
A: CONSHARE operates under ISO9001:2015 certified quality management systems, and all products comply with RoHS and halogen‑free (HF) environmental standards.
