1. CUC0983B0514B is an x8-lane high-speed connector compliant with the PCI-SIG CEM 5.0 specification. It achieves a single-lane data rate of 32GT/s through a 98-pin configuration and is specifically designed for mid-to-high-end scenarios requiring high bandwidth. Its innovative "side-slotted + no side eaves" structure not only ensures signal integrity for the x8-lane but also addresses installation challenges in confined spaces such as 1U servers and industrial motherboards, making it suitable for devices like AI accelerator cards and multi-drive NVMe storage arrays.
2. Side-Slotted Design: Balancing Heat Dissipation and Plug ReliabilityEnhanced Heat Dissipation Efficiency: The side-slotted structure expands the air convection area by over 35%. Compared with non-slotted designs, it reduces local temperature rise by 5-7℃ under full load (32GB/s) of the x8-lane, preventing performance degradation caused by heat accumulation during multi-signal-pair transmission.
3. No Side Eaves: Optimal Space AdaptationAfter eliminating the traditional side eaves, the lateral width occupied by the connector is reduced from 22mm (of conventional 98P connectors) to 18.7mm, achieving a 15% space saving. This makes it suitable for high-density layouts such as 1U servers and industrial embedded motherboards. Additionally, it reduces signal reflection caused by metal obstruction, narrows the safety distance between the EMI shield and surrounding components from 2.5mm to 1mm, and meets the layout requirements of high-density PCBs (e.g., 10-layer or more motherboards) to avoid signal crosstalk.
◆◆ Product Advantage
1. Bandwidth Doubling Capability: Compared with PCIe 4.0 x8 connectors (16GB/s), its bandwidth is increased to 32GB/s, which can be adapted to AI accelerator cards such as NVIDIA A100 and multi-drive NVMe SSD arrays.
2. Multi-form Factor Mounting Support: It is compatible with both vertical and right-angle SMT mounting methods. Two connectors can be integrated on a 15cm×20cm embedded motherboard, supporting the expansion of dual high-bandwidth devices ("GPU + NVMe SSD") without the need for additional reserved redundant space.
3. With a recommended stencil thickness of 0.15mm and reflow soldering at 260℃ for 5 seconds, it is compatible with mainstream SMT production lines, achieving a soldering yield rate of over 99.5% and reducing mass production costs.
4. High Reliability: Endurance in Extreme Environments and Long-Term Durability。Mechanical and Material Guarantee: Phosphor bronze pins (with a gold plating thickness of 150-250 microinches) are corrosion-resistant; the terminal retention force is > 3.43N, and the contact resistance remains < 50mΩ after 1000 insertions and extractions. The LCP housing is resistant to high and low temperatures, enabling normal startup at -40℃ without performance degradation.
5. EMI and Electrical Protection: The metal shield housing and PCB ground plane form 360° electromagnetic shielding, complying with the CISPR 32 Class B standard. The signal bit error rate is < 10⁻¹² in industrial high-interference environments. With insulation resistance > 1000MΩ and withstand voltage > 500V AC, it avoids the risk of electric leakage.
6. Its physical interface is completely consistent with that of PCIe 4.0/3.0 98P connectors, supporting automatic speed negotiation (5GT/s~32GT/s). A PCIe 4.0 GPU can operate stably at 16GT/s when inserted, without the need to replace the motherboard design.
◆◆ Product Uses
1. AI Training Cluster
2. Storage Array
3. Desktop Computer/Laptop Computer
4. Edge Computing and Industrial Control
5. Communications and Network Equipment
◆◆ Product Documentation
