1. The PCIe 5.0 36P connector (Model: CUC0367B0514B) is an x1-lane high-speed interface component that complies with the PCI-SIG CEM 5.0 specification. Specifically designed for space-constrained scenarios, it balances high-speed signal transmission and installation flexibility through the innovative structure of "side slotted design without side eaves", making it suitable for edge computing, embedded systems, and small-scale storage devices.
2. It addresses local heat generation issues at a speed of 32GT/s by expanding the air convection area, assists in plug-in positioning, and forms a foolproof fit with the protruding structure of the device interface through the slot, thus reducing the risk of incorrect insertion.
3. After eliminating the traditional side eave structure, the lateral installation space is reduced by approximately 15%, making it suitable for compact layout scenarios such as 1U servers and industrial embedded motherboards. At the same time, it reduces metal shielding and optimizes the spacing compatibility between the EMI shield and surrounding components.
◆◆ Product Advantage
1. It adopts PCIe 5.0 dedicated gold finger specifications — with a width of 0.6mm (reduced by 14% compared to PCIe 4.0), a signal pin length of 3.0mm, and a ground pin length of 3.2mm. Combined with the design where the inner-layer GND plane extends to the edge of the gold finger, it suppresses near-end crosstalk (NEXT) to below -40dB.
2. It complies with the CEM 5.0 specification, with 8-10mil diameter ground vias placed every 1mm in the pin gaps of the gold finger. This eliminates ground resonance, and when combined with backdrilling technology to reduce via stubs (<10mil), it ensures insertion loss of ≤-36dB in the 16GHz frequency band.
3. High-Speed Transmission Performance: It provides reliable support for a speed of 32GT/s. Based on CTLE/DFE multi-level equalization technology and pre-emphasis compensation (+8dB gain at the transmitter), it maintains signal integrity within a transmission distance of 1.5 meters.
4. Mechanical Stability: The SMT soldering process is paired with phosphor bronze pins (1μin gold plating thickness), offering an insertion/extraction life of over 1000 cycles and certification to IPC-A-610 Class 3 soldering standards.
5. Full Generational Compatibility: Its physical interface is fully consistent with that of PCIe 4.0/3.0, supporting automatic speed negotiation (5GT/s~32GT/s). PCIe 3.0 devices can operate stably when inserted.
◆◆ Product Uses
1. AI Training Cluster
2. Storage Array
3. Desktop Computer/Laptop Computer
4. Edge Computing and Industrial Control
5. Communications and Network Equipment
◆◆ Product Documentation
