 |
| Technical Specification: | |
|---|---|
| Quantity: | |
Card Edge Connector
Industrial, IT Datacom
CUF005G440108 and CUF005G440111 are the same connector. Both are 0.50 mm pitch M.2 M-key sockets molded in black halogen-free LCP, holding a 75 position card slot, 67 soldered contacts and two stainless steel hold-down pegs. The only difference between the two part numbers is the contact finish: CUF005G440108 carries 1u" gold over 10u" nickel, and CUF005G440111 carries 10u" gold over 50u" nickel. Footprint, tail positions and card slot geometry are identical, so the two parts drop into the same board.
That one difference settles what the socket costs and how well it survives being opened. What follows covers which build belongs on your board, which module sizes fit, and where this socket is the wrong answer.
Both builds are qualified to the same insertion count and the same salt spray exposure, so the heavier finish is not a corrosion upgrade. It is a wear upgrade, and that changes which one you should buy.
A one micro-inch gold layer is thin enough that its pores reach the nickel underneath from the first day of service, so the underplate, not the gold, does the corrosion work. That is a sound arrangement on a board that is assembled once, tested, and closed for good. Sealed industrial gateways, signage players, point of sale terminals and embedded controllers are all built this way.
Ten times the gold and five times the nickel under it keeps contact resistance close to its starting value through handling, angled insertion, dust and repeated re-seating. Choose this build when a technician will open the unit, when the same platform ships to humid or sulfur bearing sites, or when the module is swapped rather than fitted once. Field serviceable SSD drawers, cellular and Wi-Fi modules, burn-in racks and development platforms all sit in this group.
Ask whether anyone will ever pull the module out of the finished product. No means take CUF005G440108 and spend the saving elsewhere on the bill of materials. Yes means take CUF005G440111.
CUF005G440108 | CUF005G440111 | |
|---|---|---|
Contact gold | 1u" | 10u" |
Nickel underplate | 10u" | 50u" |
Durability and salt spray | Identical | Identical |
Built for | Modules fitted once in sealed products | Modules a technician re-seats in the field |
Effect on unit cost | Lower | Higher |
Sharing one footprint matters. Validate a board on either build, ship an entry level product on the lighter finish, and offer a rugged version on the heavier one with no layout revision. One PCB, two product tiers.
The socket takes every standard M.2 module length from 30 mm to 110 mm, and it accepts both the 22 mm and the 30 mm module widths. What moves between designs is not the connector but the position of the module standoff on your board.
Module | Module width | Standoff distance from the connector |
|---|---|---|
2230 | 22 mm | 28.25 mm |
2242 | 22 mm | 40.25 mm |
2260 | 22 mm | 58.25 mm |
2280 | 22 mm | 78.25 mm |
22110 | 22 mm | 108.25 mm |
3030 | 30 mm | 28.25 mm |
3042 | 30 mm | 40.25 mm |
That right hand column decides where the mounting hardware and its keep-out land, so fix it before you commit to a module. A platform migrating from a narrow module to a wide one keeps its connector and only re-places the standoff.
The finished assembly stands between 4.55 mm and 5.35 mm above the host board, and the module class sets that figure, not the socket. Single sided modules, the S1 to S5 classes, run the full 4.55 mm to 5.35 mm as the tallest part on the module grows. Double sided modules, the D1 to D5 classes, stay in the same band but top out at 4.85 mm. Clear 5.35 mm worst case and you have covered every standard module.
Leave at least 4.00 mm of top side clearance around the card entry. Decoupling capacitors and ESD diodes pushed against the socket mouth are the usual reason an M.2 layout is reworked after the first build. Put them behind the socket or further out.
Second, the module needs 20 to 30 degrees of swing to seat. A shield can or chassis rib close to the card edge blocks that rotation even when the flat outline has room, so check the swing volume, not the footprint.
One module fitted at the factory and an enclosure that is never reopened. The lighter finish carries this design at the lower cost with no functional compromise.
Vibration, humidity, and a technician with a screwdriver. The heavier finish holds contact resistance flat across seasonal temperature swings and field replacement.
Modules are seated and pulled repeatedly during bring-up. The thicker gold is not about product life but about how many times a lab can reuse the socket before readings drift.
It is not a power connector. Each contact is rated for a fraction of an amp, and an M.2 module draws far more than that on its supply rail, so power and ground have to be spread across several parallel positions. If your pin allocation leaves only one or two contacts for the supply, this is the wrong part for that design review, not the wrong socket.
It is also the wrong socket if the module is not M-keyed, if the design needs a vertical drop-in rather than an angled card edge, if the finished stack has to fit under roughly 4.5 mm, or if the socket will see thousands of insertions on automatic test equipment. Those four cases need different keying, a different socket style, or a different contact system entirely.
The light and heavy gold builds run as separate plating lots, and each lot is thickness checked before assembly. The two parts look identical from the outside, so a reel from the lighter line must never end up labelled as the heavier one.
Every solder tail passes AOI after forming and a coplanarity check before tape. A tail sitting a few hundredths of a millimetre high produces a void on your line, and catching it here is far cheaper than after reflow.
Cover tape peel is measured against the working window so the feeder neither drops parts nor stalls, and empty pockets lead and trail the loaded section. The carrier is polystyrene with a polyester cover film.
Both builds run on the same tooling, so neither is a tooling project and the lead time is short and predictable. Ask for the current figure against your order quantity.
Packing is 1,000 pieces per reel and six reels per carton, so a single reel covers a pilot build without a carton commitment.
Other gold thicknesses are available on the same body, which helps when a program moves from consumer to industrial qualification. To compare the two stocked finishes yourself, ask CONSHARE for samples of both and run insertion life and corrosion testing on one coupon. Send your module class, standoff position and annual volume for a build recommendation.
Yes. Same body, same footprint, same tail positions. Validate the layout on one build and switch later without a board revision.
No. Tell your mechanical team early. The module has to rotate 20 to 30 degrees to clear the socket on the way in.
Both builds are held to the same salt spray requirement, so humidity alone does not justify the upgrade. The heavier finish earns its cost where contacts are repeatedly mated and handled.
More than you expect. A module supply rail is fed through several parallel contacts because no single contact is rated to carry it alone. Budget power and ground first and give what remains to signals.
Yes. The socket accepts both standard module widths, and only the standoff position changes.
