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Board to Board Connector
Industrial, IT Datacom
When your design depends on consistent, repeatable board-to-board connectivity across thousands of production units, the difference between a commodity connector and an engineered solution becomes your bottom line. CONSHARE's 3.00mm pitch right-angle wafer connectors eliminate the three most common failure points that cause field returns and production line downtime.
Unlike generic alternatives that experience 3-5% field failure rates in high-vibration or temperature-cycling applications, our LCP-housed 2×4 pin connectors deliver <0.1% failure rates over 1,000 mating cycles—verified through independent third-party testing. This isn't just a specification on a datasheet; it's the difference between meeting your warranty commitments and costly product recalls.
Each contact pin is stamped from high-grade brass using progressive die tooling with ±0.02mm positional tolerance. Unlike cheaper stamped contacts that exhibit spring fatigue after 200 cycles, our contacts maintain normal force within 5% of original specification through 1,000 full mating cycles. The tin-plating process uses a controlled reflow method that creates a uniform intermetallic layer, preventing whisker growth and intermittent connections that plague low-cost alternatives.
The Liquid Crystal Polymer housing isn't just "heat resistant"—it's specifically formulated to withstand the thermal shock of lead-free reflow profiles without dimensional shift. At 260°C peak reflow temperature, dimensional variation measures less than 0.03mm across the entire connector body, ensuring every pin remains perfectly aligned with PCB pads. This eliminates the #1 cause of solder joint defects: misaligned pins during automated assembly.
The right-angle configuration isn't arbitrary—it's optimized for three critical manufacturing scenarios:
Parallel board stacking with precise 12.45mm clearance between PCB surfaces
Cable exit routing that doesn't interfere with adjacent components
Automated pick-and-place with optimized vacuum pickup surface
CONSHARE wafer connectors undergo accelerated life testing that simulates 10 years of field operation. Our LCP housing material maintains critical mechanical properties across the full operating range:
Environmental Condition | Test Standard | CONSHARE Performance | Industry Average |
|---|---|---|---|
Thermal Shock (-40°C to +105°C) | 1000 cycles | 0 failures, <1% resistance shift | 3-5% failure rate |
Temperature Humidity Bias (85°C/85% RH) | 1000 hours | <2mΩ contact resistance change | >15mΩ typical |
Vibration Testing (10-2000Hz, 5G) | IEC 60068-2-6 | No discontinuities >1µs | Occasional signal drops |
Mechanical Shock (50G, 11ms) | MIL-STD-202 | Zero contact damage | Housing cracking common |
Every production lot undergoes acceptance testing that includes mating cycle verification, insulation resistance testing, and dimensional inspection. We don't rely on AQL sampling—critical electrical parameters are 100% tested.
The tin plating process incorporates a proprietary anti-tarnish treatment that prevents oxidation even in high-sulfur industrial environments. After 30 days of mixed flowing gas testing (MFG), contact resistance remains within 10% of initial values—compared to 50%+ degradation observed in standard plated connectors.
Deployed in PLC I/O modules operating in factory floor environments with 20-80°C temperature cycling and 5G vibration levels. 3-year field data shows zero connector-related failures across 50,000+ installed units.
Qualified for Class II medical devices where reliability is non-negotiable. The LCP housing meets biocompatibility requirements for non-patient contact applications, and the clean manufacturing process ensures no outgassing contamination.
Used in 5G small cell power distribution boards where the 3A per-pin rating eliminates the need for separate power connectors. The dual-row design enables power and signal in a single footprint, reducing board space by 35%.
While this page features our standard 2×4 pin configuration, CONSHARE manufactures the full range of 2×1 through 2×12 pin counts—all with identical electrical characteristics and footprint compatibility. No requalification needed when scaling your design.
Every purchase includes access to our application engineering team for:
3D STEP file generation for your specific board stack
Soldering profile optimization for your PCB finish
Failure analysis support should any field issues arise
Cross-reference verification for competitor part numbers
All parts ship with full traceability and include:
Material certification reports
RoHS compliance documentation
Electrical test data per lot
Manufacturing date and lot coding
