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Board to Board Connector
Industrial, IT Datacom
CONSHARE presents a vertical SMT receptacle series designed for board-to-board stacking in compact electronic assemblies. The 0.8mm contact pitch enables high-density routing while maintaining process compatibility with standard SMT lines. This receptacle is intended for applications requiring controlled impedance, repeatable mating cycles, and thermal stability from -40°C to +105°C.
LCP thermoplastic, UL94V-0 rated, black. The material exhibits <0.02% moisture absorption and sustains 260°C peak reflow without warpage. This eliminates solder wicking into the housing body – a common failure mode in low-cost connectors.
Copper alloy selected for balanced spring properties. After stamping, the entire contact receives 50µ" minimum nickel underplating. This nickel layer serves two functions: diffusion barrier preventing base metal migration to the contact surface, and adhesion layer for subsequent finishes.
Mating interface: Selective gold (thickness orderable from flash to 30µ"). Gold preserves low and stable contact resistance through oxidation and mild corrosive atmospheres.
Solder termination: Matte tin, 80µ" minimum. Matte texture improves solder wetting uniformity compared to bright tin. The tin finish is applied only to the termination area – gold is absent here to avoid gold‑embrittlement of solder joints.
Brass with identical nickel underplate and 80µ" matte tin. Ground pins are positioned to establish early‑make/late‑break sequencing when mated with a corresponding header, reducing ESD risk during hot insertion.
The receptacle supports signal and low‑power distribution up to 0.5A per contact at 50V AC/DC. Dielectric withstand voltage is 200V AC for 60 seconds – no breakdown or flashover. Insulation resistance exceeds 500MΩ under normal conditions, dropping to no less than 100MΩ after humidity exposure.
Contact resistance is specified at 80mΩ maximum. This value includes both bulk resistance and film resistance. Production screening uses dry circuit testing (≤20mV open circuit voltage) to avoid film puncture, ensuring the measurement reflects true contact interface condition.
Operating temperature range -40°C to +105°C is validated by 500 thermal cycles with resistance monitored. The upper limit accommodates lead‑free reflow profiles and internal temperature rise in enclosed enclosures.
This receptacle mates with CONSHARE’s corresponding vertical headers to achieve fixed stack heights of 5mm, 10mm, 15mm, or 20mm between PCBs. The receptacle body height above PCB remains constant across all options; only the header changes. This design reduces unique component SKUs in your bill of materials.
Pin counts range from 10 to 140 positions (dual row, 5 to 70 pins per row). The housing length scales linearly with pin count at 0.8mm pitch per row plus end wall offsets. PCB layout dimensions are derived as:
Overall length = (0.8 × pins per row) + constant
Keep‑out zone width and mounting hole locations follow the same linear relationship
Engineers can calculate exact footprint dimensions without waiting for a drawing – the pattern is fully predictable.
Most commodity connectors specify nickel underplate as “min 1.27µm” (50µ") but do not enforce an upper limit. Excess nickel thickness induces residual stress that causes contact warpage during reflow. CONSHARE maintains nickel thickness between 1.27µm and 2.5µm – enough for barrier function without stress‑induced distortion.
The boundary between selective gold (mating area) and matte tin (solder tail) is a potential corrosion site. CONSHARE applies a 0.3mm overlap of both platings with an intermediate nickel exposure of <0.05mm. This eliminates exposed copper at the transition, preventing red plague corrosion in humid or sulfur‑rich environments.
Surface‑mount connectors fail when lead coplanarity exceeds 0.1mm. CONSHARE measures coplanarity after singulation and again after taping. Maximum deviation is held to 0.08mm (80µm). Reels are sampled every 30 minutes during production. Non‑compliant parts are rejected before packing – not after your reflow oven.
Ground terminals are formed with a 0.2mm longer protrusion than signal contacts. During mating, ground connection establishes first, discharging any static potential before signal pins touch. During unmating, ground breaks last. This sequencing is absent in many generic receptacles, yet critical for sensitive CMOS or RF interfaces.
Mating Cycles Expected | Recommended Gold Thickness | Typical Use Case |
≤50 | Flash (S0) | Internal permanent connections, low-cost consumer |
50–200 | 3–5µ" (S2/S3) | Field‑replaceable modules, battery connections |
200–500 | 10–15µ" (S4/S5) | Test points, docking stations, industrial controls |
>500 | 30µ" (S6) | Medical device connectors, high‑reliability avionics |
Thicker gold does not improve current rating or reduce contact resistance beyond a threshold. Its benefit is solely wear life and corrosion margin. Selecting unnecessarily thick gold raises cost without functional gain – CONSHARE’s S2 (3µ") satisfies 85% of commercial applications.
Parts are tested to EIA‑364 standards. Key results:
Thermal shock (–40°C to +105°C, 100 cycles): No housing cracks, contact resistance change <10mΩ.
Humidity steady state (85°C/85% RH, 500h): Insulation resistance >500MΩ, no electrolytic corrosion on biased samples.
Mixed flowing gas (30µ" gold only, 14 days): Contact resistance <100mΩ.
Reflow simulation (three passes, 260°C peak): No solder wicking into contact barrel, no housing blistering.
Full test reports are maintained for each production batch and available on request.
CONSHARE operates its own stamping and plating lines dedicated to 0.8mm pitch products. This vertical integration allows us to:
Control nickel thickness to the ±0.3µm window described above.
Inspect every reel with automated vision for bent pins and missing solder tails.
Supply sample kits containing three different stacking heights in one package – reducing your evaluation time.
Our customers in industrial motor drives and automotive telematics have reported zero connector‑related field failures across the last three years for this series, under annual volumes exceeding 500,000 units.
