As the fixed receiving terminal of the FMC (FPGA Mezzanine Card) system, the FMC 400P SEAF Socket serves as a core interface component enabling interconnection between mezzanine cards and carrier cards. It features the following characteristics:.
High Performance and Bandwidth: Supports high-speed signal transmission with single-ended and differential signal rates of up to 2 Gb/s, and a signal transmission rate of up to 10 Gb/s to FPGA serial connectors. HPC connectors further provide 10 serial transceiver pairs, laying a solid foundation for applications uch as high-speed data acquisition and digital signal processing。
Modularity and Design Flexibility: Compliant with the FMC standard (VITA 57), it decouples the I/O interface from the FPGA, simplifying the design of I/O interface modules while maximizing the reusability of carrier cards and reducing overall development costs.
Stable Receiving Structure: Adopts a dedicated positioning slot and locking mechanism design to ensure precise alignment during mating with plugs. This prevents poor contact caused by vibration or insertion/extraction, enhancing the long-term operational stability of the system.
◆◆ Product Advantage
High Data Transfer Capability: The FMC interface supports a signal transmission rate of up to 10 Gb/s, with a potential total bandwidth of 40 Gb/s between the mezzanine card and carrier card, meeting the requirements of high-speed data transmission.
Superior Signal Quality: Adopts differential signal transmission technology, featuring strong anti-interference capability to effectively ensure the integrity and stability of high-speed signal transmission
Standardized Compatibility: Strictly complies with the VITA 57 standard, equipped with standardized power interfaces and signal definitions. It is compatible with mainstream FMC carrier cards and mezzanine cards, reducing the costs of selection and replacement.
High-Density Stable Interconnection: Boasts a total of 400 contacts arranged in 10 rows (40 pins per row, 10 rows × 40 pins) with a 1.27mm pin pitch. The socket end adopts an enhanced contact structure, ensuring uniform contact pressure for each contact, reducing contact resistance, and improving the stability of current transmission.
Anti-Misinsertion and Locking Design: Integrates a physical anti-misinsertion structure to prevent damage caused by reverse insertion. It cooperates with the plug's locking mechanism to form dual fixation, adapting to vibration and impact scenarios in industrial environments and ensuring a secure, non-loose connection.
Optimized PCB Compatibility: Utilizes SMT (Surface Mount Technology) with bottom solder pins designed to be compatible with PCB boards of different thicknesses (0.8-2.0mm). It offers high flatness after soldering, reducing the risk of cold solder joints.
◆◆ Product Uses
1. Communication Systems
2. Test and Measurement Equipment
3. Industrial and Medical Imaging
4. Defense and Aerospace
5. Research and Prototype Development
6. Emerging Technology Fields
◆◆ Product Documentation
