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Card Edge Connector
Industrial, IT Datacom
Most engineers reach an edge-card connector only when a PCIe 4.0 add-in card, riser, or proprietary module needs a retention strategy that won't fail mid-vibration. The hardware on this page is purpose-built for that exact situation: a 1.00 mm pitch, dual-row SMT edge card header with a mechanical latch on each end, a one-piece LCP housing that carries the PCIe 4.0 logo as molded identification, and a copper alloy contact system tuned for 16 GT/s signaling inside an enclosed chassis.
It is not a generic 64-pin header, and it isn't sold like one. Keep reading if you're trying to decide whether it belongs in your next build — or whether a competing part is going to cost you two months of qualification work later on.
The form factor puts 64 contacts across two rows (A1–A32 and B1–B32), carrying both the standard PCIe edge-card fingers and the sideband signals expected on most Gen4 architectures. The 1.00 mm contact pitch keeps the connector footprint narrow enough to drop into dense server backplanes, while the SMT termination lets a fully automated line populate it without secondary wave-pass steps.
The latch is the part most datasheets undersell. Two brass latches — one at each end of the housing — deflect to accept a 1.57 ± 0.05 (2X) thick mating edge card, then spring back to lock the card against the contacts. On a chassis that ships through freight, that mechanical retention is what separates a "passes bench test" connector from one that survives six months of thermal cycling in the field.
If your design file looks anything like the projects below, this part belongs on your shortlist:
PCIe Gen4 add-in cards and risers where the board slides into a chassis slot and needs positive retention rather than just contact friction
GPU/CPU bracket-to-motherboard links in compact workstations where a full-size card edge won't fit
NVMe carrier cards, RAID controllers, and accelerator modules with 1.57 mm nominal edge card thickness
Embedded backplanes running 16 GT/s signaling across a card-to-board interface rather than a board-to-board stack
It's not the right choice for hot-plug server bays (no hot-plug shrouds), not the right choice for cards thicker than the standard 1.57 mm edge, and definitely not the right choice for any application that needs to run above 85 °C ambient.
These are the figures you actually want to compare against your existing BOM, not because they look impressive, but because they're the ones that have to pass your qualification:
Parameter | Specification | What It Means in Practice |
|---|---|---|
Contact Resistance | 30 mΩ max | Stable link margin across 50 mating cycles |
Insulation Resistance | 1000 MΩ min | No cross-talk surprise on long trace runs |
Dielectric Strength | 500 V DC / 1 min | Survives production hipot without field leakage |
Current Rating | 1.1 A per pin min | Handles auxiliary power distribution on the riser |
Insertion Force | 115 N per contact pair max | Predictable force budget during assembly |
Withdrawal Force | 0.15 N per contact pair min | Card pops free at service, not mid-shipment |
Durability | 50 cycles | Field-servicing, not consumer-grade mating |
Operating Temp | −25 °C to +85 °C | Standard data-com ambient window |
The contact system under the housing is phosphor bronze at 0.25 mm thickness, gold in the mating zone, tin in the SMT tail, with a nickel underplate across the full part. Same recipe on the brass latches, minus the gold.
The housing is a single LCP + 30 % glass-filled part, UL94V-0 rated, with no glued-in identifier plate. On a connector that lives inside a chassis for years, that's the difference between a label that scrapes off and a part you can still identify in service.
The contacts land on a 1.00 mm pad pitch with co-planarity tight enough for reflow. There's no secondary pin-in-paste operation, and no flux wicking risk into the housing — both common failure modes when a "PCIe 4.0" edge card connector is retrofitted onto an SMT line.
The housing stays identical between BR0641X46 and BR0641X47 part codes. What changes is what covers the contact tails during shipping and reflow: BR0641X46 ships with a CAP structure designed to survive a 250 °C profile, while BR0641X47 ships with a Mylar cover (reference drawing) for customers who run their own board-level protection. Pick the packaging code that matches how your SMT line is set up — not the one that's in stock.
It looks cosmetic but it isn't. The molded logo means the housing is a single LCP + 30 % glass-filled part, UL94V-0 rated, with no glued-in identifier plate. On a connector that lives inside a chassis for years, that's the difference between a label that scrapes off and a part you can still identify in service.
Every lot is run on the same horizontal high-speed stamping line for terminals and latches, with the housing molded in a Class 100K cleanroom. 100 % electrical test on contact resistance before tape-and-reel packaging.
Standard parts in flow code BR0641X46XXX-X-X-X ship in 2–3 weeks for orders under 50 K pcs. For custom plating codes (gold flash, 30 µ" gold, full gold) the lead time is 4 weeks because the plating reel needs a scheduled bath. Any combination of pin count, plating thickness, latch color, and housing color can be quoted against a fresh tool. CONSHARE typically returns tooling feasibility inside 5 business days and NRE pricing inside 7.
The connector can be co-packed with your mating edge card or mated M.2 / riser assembly on the same reel for SMT lines running sequence-critical builds.
This is where most of the wrong-PO decisions happen. The flow code BR0641X46X XX XX reads roughly as Plating, Latch code, Environment, Packing, Color. Two rules of thumb from our field engineering desk:
Plating Code | Best Fit | Avoid If |
|---|---|---|
A (flash gold, tin tail) | Cost-sensitive consumer, single-mate application | Field-service life > 3 years, vibration-heavy chassis |
B (30 µ" gold, tin tail) | Standard commercial / industrial Gen4 risers | Severe corrosive atmosphere |
C (15 µ" gold, tin tail) | Mainstream Gen4 add-in card builds | High-cycle mating duty |
D (15 µ" gold in mating, gold flash in solder) | Mixed-signal assemblies where tail wetting matters | Standard pad finishes |
E (15 µ" gold mating, tin solder) | Most common Gen4 line, balanced cost | Cost-aggressive consumer builds |
If the application doesn't pin the answer, ask our engineering desk to run the trade against your mating card material — we'll send back a written recommendation rather than a default spec.
A customer running a 2U AI inference server had this exact failure pattern: a competitor's "PCIe 4.0 SMT" header was surviving 1,000-hour HALT testing but failing at 8-month field returns with intermittent Gen4 link drops. Root cause turned out to be a missing LCP barrier at the contact-to-housing interface, allowing flux migration under the contact during reflow. Switched to this CONSHARE part (BR0641X46B2R-H for that chassis) and the field return rate dropped to zero at the next quarterly review. The change wasn't the gold thickness — it was the housing barrier geometry. Worth asking about whenever a quoted part seems too cheap.
A: The connector accepts the standard 1.57 mm PCIe edge-card fingers used on x1 through x16 cards. The mechanical retention force scales with the number of active contacts, so x16 cards will need the full 1.1 A / pin current budget validated against your trace geometry.
A: The latch is a deflection part — pushing the card edge inward (parallel to its plane) releases the beam and frees the card. No tool required, no over-travel stress on the housing.
A: Server-grade hot-plug parts run 200–500 cycles. This connector targets add-in cards and risers that mate once at build or at most a handful of field replacements — typical commercial/industrial duty.
A: Yes. CONSHARE routinely runs 36 P, 48 P, 64 P, and 98 P variants from the same die set. Custom pin counts add 4 weeks to lead time and require a tooling deposit for first article.
A: As standard, no. If your project needs a matched edge card, CONSHARE can co-source a complete card-edge assembly tested as a pair.
A: 3D step model, recommended PCB layout (component and edge-card sides), tape-and-reel drawing, and electrical/mechanical datasheet. Samples are typically shipped within 7 days of an engineering request.
Item | Value |
|---|---|
Series / Family | (not published) |
Configuration | 64P (A1–A32 / B1–B32) |
Pitch | 1.00 mm |
Termination | SMT, vertical |
Housing | LCP + 30 % GF, UL94V-0, black |
Contact / Latch | Phosphor bronze 0.25 mm / Brass 0.30 mm |
Plating | Au in mating, Sn in solder, Ni underplate all |
Through-Lock | Brass latch, both ends |
Operating Temp | −25 °C ~ +85 °C |
Packaging | Tape & Reel, 250 pcs/reel, 1250 pcs/carton |
