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Card Edge Connector
Industrial, IT Datacom
If your PCIe add-in card design has ever failed validation because the connector sat too shallow in the through-holes—or because a standard 2.5 mm tail barely poked through a multi-layer stackup—then you already know why solder-tail length is not a trivial line item on a BOM. CONSHARE ships this 64-pin, 1.00 mm pitch edge-card connector in two DIP solder-tail variants so procurement and layout engineers stop over-specifying the wrong part.
The BR06401A1K1ER ships with a 2.50 mm solder tail, matched to conventional 1.6 mm FR-4 boards where the connector sits flush and wave-solder fillets form cleanly on the secondary side. It keeps the connector profile low—useful when add-in card bracket clearance is tight, as it often is in 1U and 2U rackmount chassis.
The BR0641A21K1ER extends the tail to 3.10 mm. This variant exists for boards running thicker than 1.6 mm, carrying extra ground-plane layers for signal integrity, or spacing the connector body slightly off the PCB with a thermal pad. The additional 0.60 mm ensures the solder joint fills the full barrel of each plated through-hole. Insufficient tail protrusion is one of the most common root causes of intermittent PCIe lane failures in field returns—and it is entirely preventable at the BOM stage.
Part Number | Solder-Tail Length | Guide-Post Type | Terminal Material |
|---|---|---|---|
BR06401A1K1ER | 2.50 mm | Traditional (closed) | C2680 (phosphor bronze) |
BR0641A21K1ER | 3.10 mm | Open-end | Brass |
Liquid crystal polymer, UL 94V-0 rated, in black. LCP holds its geometry through peak reflow (deflection temperature 255 °C), does not wick moisture during storage, and delivers the dimensional stability that a 1.00 mm pitch connector demands. A housing that warps by even 0.05 mm during soldering will shift pin alignment enough to raise insertion force across 64 positions—or create a latent contact stress point that only shows up after thermal cycling.
The terminals are stamped from 0.25 mm stock and selectively plated. Gold sits in the contact zone at 80 µ" minimum; tin coats the solder area at 30 µ" minimum. CONSHARE offers five gold-thickness grades for the contact zone—from flash gold for cost-sensitive consumer cards to 15 µ" for industrial environments demanding corrosion resistance across a decade of service. The tin specification stays constant across all grades, because solderability is never a feature to negotiate down.
A full nickel barrier runs beneath both the gold and tin layers. Without it, copper migration from the base alloy into the gold contact surface degrades contact resistance within months—especially in high-humidity production environments common in Southeast Asian assembly floors. The underplate is the quiet spec that separates connectors built for volume manufacturing from those that fail Q/A six months after deployment.
Per-pin current rating sits at 1.1 A minimum, which is conservative for PCIe 4.0 / 5.0 lane pairs that typically draw well below 500 mA. The real value is thermal headroom: when adjacent pins carry near-maximum current simultaneously—as they do in auxiliary power-delivery traces on riser cards—a 1.1 A per-pin floor prevents the connector from becoming the thermal bottleneck.
Contact resistance is held to 30 mΩ maximum, consistent with PCI-SIG recommendations for edge-card interconnects. Insulation resistance exceeds 1,000 MΩ from position to position, and dielectric withstand is rated at 500 V DC for one minute. These are not headline numbers, but they are the numbers that quietly keep bit-error rates flat when the chassis environment is electrically noisy—think multi-GPU mining rigs or industrial machine-vision systems sharing a backplane with motor drives.
Sixty-four contacts per connector means real friction. The spec caps insertion force at 1.15 N per contact pair, which translates to roughly 73.6 N total across the full connector width. That is deliberate: it is firm enough to keep the card seated through vibration testing, but not so stiff that an operator on an assembly line risks board flex during manual insertion. The guide posts—open-end on the 3.10 mm variant—absorb the initial alignment load before the contacts engage, reducing the chance of bent pins when an add-in card is inserted at a slight angle.
Extraction force bottoms out at 0.15 N per contact—enough to prevent back-out during shipping. Durability is rated for 50 mating cycles, which covers prototyping, field replacement, and lifecycle testing without meaningful degradation in contact resistance.
CONSHARE ships both variants with a tested PCB footprint. The recommended layout calls for 64 plated through-holes at Ø0.70 + 0.08 mm, spaced at 1.00 mm pitch, with the outermost hole centers spanning 62.35 ± 0.05 mm. The drawing also provides a recommended edge-card pattern for the mating side, including secondary-side pad geometry. Ignoring the recommended pad sizing—especially on the secondary side—is the fastest path to tombstoning during reflow or incomplete barrel fill during wave soldering.
The 1.00 mm pitch is dense. If your PCB fab house struggles with annular ring control at sub-0.5 mm via pad diameters, verify their capability against the Ø0.70 mm hole spec before releasing the Gerbers.
The BR064 series ordering string encodes several choices beyond just tail length.
Five gold-thickness options sit in the contact-area spec, from flash gold (code A) through 15 µ" (code E). All five share the same tin spec in the solder zone. The choice comes down to mating-cycle expectations and environmental exposure: flash gold is adequate for low-cycle consumer cards in climate-controlled interiors; 15 µ" is the floor for outdoor telecommunication gear or factory-floor equipment.
Housing color defaults to black (K1), with white (L1) available for lines that use automated optical inspection and need contrast between the connector body and the PCB. Environmental compliance codes cover RoHS (3) and halogen-free variants. These are not afterthought suffixes—they are how the part number communicates supply-chain compliance without a separate datasheet addendum.
Standard packaging uses anti-static trays compatible with JEDEC-style pick-and-place feeders. Tube and bulk-box formats are also available. Trays feed directly into most placement magazines with zero repacking labor—a small detail that adds up when you are running 5,000 boards per shift.
CONSHARE connectors go through a 100% automated optical inspection pass before packaging. Pin coplanarity, terminal seating depth, and housing flash are checked at production speed. Plating thickness is verified via XRF on every production lot—not on an AQL sampling plan. The LCP resin lot is traceable back to the supplier's molding batch, so if a material variance ever surfaces, the affected batch is isolated within hours.
Both the 2.50 mm and 3.10 mm variants are held at the Shenzhen distribution center. Standard dispatch is within 48 hours of order confirmation for quantities under 10,000 pieces. Custom plating or packaging configurations typically ship in 3–4 weeks, and small-batch trial orders are supported before full production commitment.
No. This is a 64-pin connector, which maps to a PCIe x4 electrical interface (plus sideband and power). PCIe x8 requires 98 pins, and x16 requires 164 pins. Match the physical pin count to the lane width your add-in card needs.
The open-end design eases initial card alignment during insertion. Once fully seated, retention force is governed by contact normal force—not guide-post geometry—so there is no meaningful difference in long-term retention between the two styles.
A 0.12–0.15 mm stencil, assuming laser-cut or electroformed foil, deposits enough paste volume for a reliable fillet without bridging adjacent pads at 1.00 mm pitch. For the 3.10 mm tail variant on thicker boards, use 0.15 mm to compensate for the longer barrel volume.
Keep them in the original sealed anti-static packaging, in a humidity-controlled environment (≤60% RH). LCP absorbs negligible mois
ture, but the tin-plated solder tails will oxidize if exposed to uncontrolled humidity for more than 12 months, degrading solder wetting.
White housing orders require a minimum of 1,000 pieces per shipment. Black is the standard stocking color with no MOQ beyond the standard tray quantity.
