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Card Edge Connector
Industrial, IT Datacom
Most PCIe card-edge sockets you find in the catalog are designed around a standard x16 or x1 lane layout with retention ears and a polarizing post. That's fine when your board has the space. It stops being fine when you're packing 64 signal lines into a 39 mm footprint on a board where the area around the slot is shared with antennas, M.2 sockets, or stacked-height components.
This is the part you reach for in that situation. The PCIe 64P Clamp-Type connector from CONSHARE drops the retention ears and the locating post and instead uses an integrated clamp foot at each end. The card snaps in, the clamps hold it, and you've reclaimed roughly 4–6 mm of keep-out on each side of the housing. The body still reads as a 64-position PCIe card-edge socket — the same 1.00 mm contact pitch, the same 0.33 mm wide gold finger — but the mechanical envelope shrinks.
If you've only looked at the catalog page, here is what each dimension on the specification actually means for your build.
The daughter card that plugs in is not freeform — it has a defined geometry that lets the 32 contacts per row land cleanly and the clamp foot register without forcing. The recommended edge-card pattern calls for 0.70 ± 0.05 mm wide gold fingers on a 1.00 mm pitch, mirroring the A1–A32 and B1–B32 contact rows of the connector. Primary-side contact zones are spaced 10.00 mm, then a 3.00 mm clamp pocket, then 20.00 mm — which is exactly the same 11.65 / 21.65 split you see on the connector body. The card edge itself needs a 20° chamfer, 1.57 mm long, 1.40 mm deep, so the leading edge of the PCB doesn't crash into the contact beams during insertion.
The secondary side is intentionally offset by 1.90 ± 0.06 mm. That's not a mistake and it's not optional — it's the asymmetry that keeps the card from being inserted upside-down. If you mirror the primary side pattern on both sides of your card, the connector will still accept it, but pin A1 will be where pin B32 should be. The four corner radii (C0.50 × 4) on the secondary-side pad pattern exist for the same reason: mechanical registration, not electrical.
The connector itself solders onto a host PCB. The recommended PCB layout calls for SMT pads on a 1.00 mm pitch, 0.70 ± 0.05 mm wide, with a 3.60 mm pad zone split by a 1.40 mm keep-out in the middle. Top-side pads carry contacts A1–A32 in a 10.00 + 3.00 + 20.00 sequence; bottom-side pads mirror B1–B32 in the same pattern. PCB fabrication tolerance for this layout is held to ±0.05 mm — that's tighter than a standard consumer PCB fab quote, so flag it to your board house early if you're using one of the discount vendors.
The DIM K specification is the host PCB thickness — 1.60 mm for the X37 variant, 2.00 mm for X52. Pick the wrong one and the solder tail stand-off changes, which moves the connector's vertical position by 0.4 mm and can shove it into an enclosure feature or pull it below a panel cutout line.
Variant | DIM A | DIM K (PCB) | Use When |
|---|---|---|---|
BR0641X37XXXX | 1.40 mm | 1.60 mm | Standard 1.6 mm FR-4 stack-up |
BR0641X52XXXX | 1.65 mm | 2.00 mm | Heavier PCB or backplane |
They are not interchangeable. Check your board thickness before ordering, not after.
The clamp foot is the differentiator, so it's worth being specific about where it pays off and where it's the wrong call.
You need retention force without the height penalty of a latching frame or screw-down. The card is changed rarely — service loops, programming fixtures, docking boards, test jigs. The board has RF components within 5 mm of the slot edge that would couple noise to a metal ear. You're stacking cards and the next slot is too close for an ear to clear.
The card will be inserted and removed daily in the field — the 50-cycle rating will burn through fast. The mating board is thicker than 1.6 mm without using the X52 variant. You need a positive mechanical lock — the clamp is friction and spring force, not a latch.
Common spots we've seen this part land: PCIe riser boards in compact SFF PCs, industrial control backplanes where vibration tolerance matters more than cycle life, medical imaging daughter cards, and test/programming fixtures for OEM production lines.
A few details that don't show up in the marketing copy but matter when you're qualifying a new supplier.
Housing is PANT LCP, UL94 V-0 rated, black. Contacts are brass at 0.25 mm stock thickness, plated with a minimum 30 μ" nickel underlayer overall, gold on the contact zone (flash or up to 30 μ" depending on the part number suffix — see ordering codes below), and 80 μ" minimum tin on the solder tails. Every lot ships with material certification available on request.
Every production batch is sample-tested against the published limits: 1.1 A per pin current rating, 30 mΩ maximum initial contact resistance, 1000 MΩ minimum insulation resistance at 500 V DC, and 500 V AC dielectric withstand. These are not design targets — they are the rejection criteria during incoming QA.
Insertion force is held to 1.15 N maximum per contact pair, with 0.15 N minimum unmating force. The 50-cycle durability rating is verified on a sample basis per lot, not just at the design stage. If you need a higher cycle count for a specific application, talk to us before tooling up — there are options.
The part is RoHS-compliant by default. Halogen-free and GP (gold plating only, no tin) variants are orderable through the part number suffix. Lot codes are stamped on every reel or tray, and the certificate of conformance ties the lot back to the production batch, plating run, and housing mold.
The full part number structure: BR 064 1 X XX XX X X
064 = pin count (this is the 64-pin variant)
Plating suffix: A = flash gold, B = 3 μ", C = 5 μ", D = 10 μ", E = 15 μ", G = 30 μ" — choose based on mating cycle expectation and corrosion environment
Packing: C = tray, E = carton box
Environment: R = RoHS (standard), G = GP, H = halogen-free
Standard orders for catalog configurations ship in 2–3 weeks. Custom requests we can support without re-tooling include: alternative gold thickness, custom HSG color (black is standard; other colors require minimum commitment), modified DIM A within ±0.20 mm of standard, and pre-formed solder tail lengths for selective wave soldering.
Requests that require re-tooling — different pin count, changed overall length, or a fundamentally different contact geometry — go through our application engineering review and typically carry a 6–8 week lead time on the first article. We will tell you upfront if a request crosses that line.
No. Standard add-in cards use the retention ear geometry defined by the PCI-SIG specification. This connector is for embedded, board-to-board PCIe signaling where the mating card is purpose-built, not a commercial GPU or NIC.
Yes. Specify plating code G in the part number. We've shipped these into industrial and outdoor applications where the standard flash gold would have corroded within the design life.
It's the published specification and the lot acceptance criterion. In practice the contacts will survive more cycles if insertion is clean and aligned, but we won't warrant beyond the spec without a documented application review.
The card will seat too deep, the contact normal force drops, and you get intermittent connections — usually at the worst possible time. Switch to BR0641X52.
Yes — STEP and IGES files plus a recommended PCB land pattern are available on request with the part number.
