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Card Edge Connector
Industrial, IT Datacom
Most M.2 sockets get picked in a hurry, and the Key E slot punishes a rushed decision hardest. It has to hold a wireless module designed by someone else, on a footprint you fixed months ago, and keep holding it after the third field swap. CUF006G67M1XX is a 0.50 mm pitch Key E socket with 67 contacts, a 4.0H body, phosphor bronze terminals and a 15 u" gold contact build. CONSHARE runs it on the same plating line as the rest of our M.2 product family.
Key E is not a general purpose slot, so settle first what can physically enter it. The key sits in the 24 to 31 position band, which means WLAN and Bluetooth combo modules, CNVio2 cards, LoRa and Sub-GHz radios, E-key edge accelerators and A+E key cards all drop in. A Key M NVMe drive, a Key B SATA drive and a B+M key card do not. Buyers usually discover that after the carrier board is fabricated. We ask for the card specification before we quote.
The slot is cut for an 0.80 mm card edge with a 0.30 mm chamfer, so modules built to standard M.2 card thickness enter with even force. Stiff insertions rarely come from the socket: usually a burr on the card edge, or a carrier board cut thicker than 0.80 mm. When a fixture feels tight, check the card first.
The same socket takes 22 mm wide cards from 2230 through 22110, plus 30 mm wide cards at 3030 and 3042. Only the retention screw moves.
Card size | Board area used | Screw centre from socket face | Typical E-key use |
|---|---|---|---|
2230 | 22 x 30 mm | 28.25 mm | Wi-Fi and Bluetooth combo modules |
2242 | 22 x 42 mm | 40.25 mm | Wireless modules with longer RF sections |
2260 | 22 x 60 mm | 58.25 mm | Legacy wireless designs |
2280 | 22 x 80 mm | 78.25 mm | E-key cards needing a longer stack |
22110 | 22 x 110 mm | 108.25 mm | Industrial and test carrier cards |
3030 | 30 x 30 mm | 28.25 mm | Wide modules with on-board antennas |
3042 | 30 x 42 mm | 40.25 mm | Wide modules with a larger radio section |
A 2230 Wi-Fi card and a 3042 wide card share one reel of sockets and one board layout. On a family whose radio changes by region, that is one layout instead of two.
The socket adds resistance and very little else you can blame later. Contact resistance is 55 mΩ per contact when new, and no more than 75 mΩ after environmental testing. Current is rated at 0.5 A per contact, voltage at 50 V.
Run that arithmetic before you allocate power pins. A wireless module pulling 1.5 A from the 3.3 V rail in a transmit burst, spread across five contacts, puts 300 mA through each one. At 55 mΩ that is 16.5 mV per contact, and roughly 22.5 mV once the contact has aged. Return current travels through ground contacts with the same resistance, so the sag counts twice. The socket cannot add copper for you, and how many contacts you spend on power and return is usually settled by default rather than on purpose.
Insulation resistance is 500 MΩ at 500 V DC, and the parts withstand 300 V AC RMS for a minute. On a 3.3 V interface neither will ever be your limiting factor. The two numbers that will bite are 0.5 A and 75 mΩ per contact. The high speed pairs on an E-key card are short. Whatever impedance discontinuity ends up on your channel is decided by the land pattern and the trace that reaches it. No socket rescues a bad transition.
Packaging is 44.4 mm carrier tape, 1000 pieces per reel, six reels per carton, 6000 pieces per shipping box, on a 330 mm reel. Cover tape peel runs between 0.01 and 0.13 kgf at 300 mm/min, and empty pockets lead and trail the loaded section so the feeder indexes before the first part arrives.
Two items deserve plan review. First, 44.4 mm tape needs a 44 mm feeder lane, not 32 mm. If your placement plan assumed narrower tape, lane assignment changes. Second, the halogen-free LCP housing takes a standard SMT reflow with a 260 °C peak held 10 to 20 seconds, but the top side of the board must stay clear for 4.00 mm at the card entry, and nothing may sit inside the 20 to 30 degree swing the card needs to enter. Decoupling capacitors inside that swing are the most common cause of a card that seated on the bench and then refused to seat in the chassis.
Two stainless steel hold-down pegs carry the peel load off the contact row. Matte tin all over, so they solder on the same profile as the contacts. Keep the copper and mask around each peg clear so the housing lands flat.
Gold thickness applies to the contact area only. The solder area is gold flash over a 50 u" nickel underplate on every build, which keeps the tails oxide free without the whisker question matte tin raises on a fine pitch tail.
Contact gold | Solder area | Salt spray |
|---|---|---|
1, 3, 5 or 10 u" | gold flash over 50 u" Ni | 24 hours |
15 u" or 30 u" | gold flash over 50 u" Ni | 48 hours plus 48 hours dry |
Salt spray performance steps at 15 u". That step is why this build suits outdoor cabinets, rooftop radios, vehicle mounted gateways, and any product that clears a coastal warehouse. Above 15 u" you are buying insertion durability and a more stable contact resistance, not more corrosion resistance. If your specification does not ask for it, we will say so.
Gold thickness on every plating lot, measured by XRF, so the 15 u" on the order is the 15 u" in the pocket. Coplanarity and AOI across all 67 tails. Peg height, because a peg a tenth of a millimetre proud props the housing off its pads and the joint still looks clean on X-ray. Cover tape peel force rechecked at production speed on the finished reel.
Gold thickness is a plating change, not a mould change, so all six builds come off the same tooling. Standard builds ship from stock, and a non-stocked gold thickness is quoted per lot with samples in days rather than weeks. Reel and carton quantities are configurable. The mould, the 0.50 mm pitch, the 67 positions and the peg layout are fixed, and we would rather say that at the start than have you find out in a build.
Four limits are worth stating up front.
Operating window is -40 °C to +80 °C. Burn-in racks, sealed outdoor cabinets and power dense enclosures can sit above that. Raise it early and we will say whether another build suits better.
60 mating cycles is the design life. A card swapped weekly by an operator is not a fit, and a production fixture re-seating a card 20 times a day spends the cycle budget in one shift.
A card with no retention screw. The socket guides and contacts the card; it does not latch it. A test carrier with no screw boss needs its own fixture.
A Key M card, a Key B card, or more than 0.5 A per contact. None of these work here, and no variant of this part changes that.
No. A Key M card has its notch in a different band. What fits are E-key and A+E key cards.
A step up in salt spray class, from 24 hours to 48 hours plus 48 hours of dry recovery, and more wear margin in the contact area. On a module installed once at the factory, that step is usually the whole reason to choose it.
No. The same part takes 3030 and 3042 cards alongside the 22 mm wide range.
Yes. Gold thickness is a plating change, not a tooling change, so there is no mould cost behind the swap.
44.4 mm carrier tape, 1000 pieces per reel, six reels per carton, 6000 pieces per box. Book a 44 mm feeder lane. Cover tape peels at 0.01 to 0.13 kgf at 300 mm/min.
