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Card Edge Connector
Industrial, IT Datacom
A DDR3 DIMM socket either disappears into a reliable product or shows up later as a field-return. CONSHARE’s finished-assembly 240-pin DIP socket is aimed at teams that want the first outcome: a connector that seats cleanly, retains the module through vibration and thermal cycles, and lets service techs swap memory without fighting the ejectors.
This is not a kit. The Nylon 66 housing, brass contacts, and ejector clips are already pressed and aligned, so your line operators place one part, not twenty. The 1.00 mm pitch contact grid matches standard DDR3 DIMM modules, and the through-hole DIP tails give the socket a mechanical anchor that surface-mount alternatives simply cannot match.
The socket follows the same extractor keep-out and body envelope that DDR3 motherboards expect. That means the PCB footprint, module clearance, and ejector swing radius line up with existing board layouts — useful when you are replacing a legacy socket or designing a long-life industrial board around a proven form factor.
Color is more than branding on a production floor. A contrasting ejector clip gives operators a quick visual handle during insertion and removal, while a matched black-on-black socket keeps the board looking clean in consumer or kiosk applications.
Part Number | Housing | Ejector Clip | Typical Use |
|---|---|---|---|
BR0101A01F3CR | Sky blue | White | High-visibility assembly and repair stations |
BR0101A01K1CR | Black | White | Neutral boards where the clip needs to stand out |
BR0101A02K1CR | Black | Black | All-black systems or minimal-visibility installs |
All three variants share the same pad pattern and component keep-out, so switching colors does not require a PCB respin.
The recommended PCB footprint stays within a 142.0 mm max envelope. The drawing marks a clear keep-out zone around the extractor swing path, which is easy to forget if you only look at the socket body. CONSHARE recommends treating that extractor zone as a no-component area on both top and bottom layers — especially under the lever pivot points.
Depending on your board thickness and retention needs, the layout supports two center-mounting styles:
Center slot — gives slight lateral tolerance during wave soldering, helpful for large panels.
Center round hole — tighter positional control for boards that go through automated optical inspection.
Pick the one that matches your solder process and inspection tolerance; the socket body and contact positions remain identical.
The recommended module layout defines the component area above the socket. Plan your tallest capacitors, heatsinks, or RF shields around that envelope, and the DIMM will seat flat without interference. Pin 1 to Pin 120 and Pin 121 to Pin 240 are oriented symmetrically, so module insertion is keyed and reversible only along the correct axis.
The brass terminals carry three distinct finishes for three distinct jobs:
Nickel underplate across the whole terminal blocks copper migration and adds hardness.
Gold flash on the contact area keeps initial contact resistance low and prevents oxidation on the mating surface.
Tin on the solder tails wets reliably in lead-free wave and selective soldering without paying for gold where it does no good.
That combination lands a 30 mΩ max initial contact resistance and 1000 MΩ min insulation resistance at 500 V DC, with a 500 V AC withstand rating.
Retention force is 300 g min per pin, insertion force is 10.89 kgf max full-set, and unmating force is 1.68 kgf min full-set. In practical terms: the module clicks in positively, stays put during shipment, but still releases without pliers during field service. That window matters for memory test fixtures where modules are swapped dozens of times a day.
Every production lot is sampled for contact insertion/extraction force, solderability per IPC-J-STD-002, and dimensional CPK on critical mating features. Mold tooling is maintained in-house, so color batches stay dimensionally consistent even when resin suppliers change.
The housing carries a D/C YMDD date-code field. That gives you batch traceability without adding a separate label step — important for OEMs tracking component genealogy across multi-year projects.
Default shipment is in C-tray packaging, which protects the ejector clips and contact tails during transport and feeds cleanly into manual or semi-automated board-loading stations.
Industrial motherboards and embedded PCs running long-life DDR3 designs
Memory test and burn-in fixtures with frequent module swaps
Telecom and network appliances needing through-hole retention strength
Legacy server and desktop board repair/replacement programs
Custom SBCs where vibration resistance outweighs SMT density goals
CONSHARE can support non-standard requests without forcing a full redesign:
Housing and clip colors beyond the three standard options (MOQ applies)
Gold thickness upgrades on the contact area for harsh environments
Laser marking or custom date-code formats
Tape-and-reel packaging for high-volume pick-and-place lines
Module insertion/extraction force tuning for specialized test fixtures
When you request a quote, include the target part number, estimated annual volume, and any packaging preference. That keeps the response to one round instead of three.
Yes. BR0101A01F3CR, BR0101A01K1CR, and BR0101A02K1CR use the same footprint, keep-out, and contact stack. Only the housing and clip colors differ.
Physically yes — DDR3L modules use the same 240-pin DIMM keying. Voltage support depends on the memory controller on your board, not the socket.
The socket arrives fully built. You place it once, solder the tails, and move on. No contact insertion, no clip mounting, no alignment fixtures.
Use the center slot if your panel tolerances are looser or the board is large. Use the center round hole for tighter positional control and AOI-friendly layouts.
Yes. The standard plating and Nylon 66 housing are specified for RoHS-compliant lead-free soldering processes.
For samples or a quote on BR0101A01F3CR, BR0101A01K1CR, or BR0101A02K1CR, send CONSHARE your volume estimate and target color combination.
