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Board to Board Connector
Industrial, IT Datacom
Most 0.80 mm board-to-board work happens at five or six millimetres of separation. Put a camera can, a shield or a row of tall capacitors on the upper board and the gap opens to roughly 10 to 13 mm, where a short body cannot reach.
CONSHARE builds this 80-position floating receptacle for that range: black LCP, 3 µin gold on the contact area, ordered as AAC8F080G2083R1. One thing to settle first: 8.30 mm is the plastic body alone, and the gap you get depends on the plug.
Plug body height | Finished board gap | What usually has to fit in that gap |
|---|---|---|
4.80 mm | 9.75 mm | Thin shield can, flex stiffener, low-profile sensor board |
6.80 mm | 11.75 mm | Camera module, display driver, modem card |
7.80 mm | 12.75 mm | Taller module stacks, battery-backed sub-boards |
Below 9 mm, take the 4.90 mm body: it covers 6.50, 8.00 and 9.00 mm.
Measure from the host board solder mask to the underside of the mating board, not from the tallest component. Then add the three things people forget: board thickness tolerance (1.6 mm at ±10% moves 0.16 mm), paste height variation along 41 mm, and reflow bow. Between 9.5 and 13 mm and you are in range.
Positions | Contact span, pin 1 to last | Overall body length | Commonly used for |
|---|---|---|---|
60 (2 x 30) | 23.20 mm | 33.00 mm | Sensor bridges, low-count control links |
80 (2 x 40) | 31.20 mm | 41.00 mm | Camera and display interfaces, mixed high-speed plus control |
100 (2 x 50) | 39.20 mm | 49.00 mm | Wide parallel buses where every lane needs its own return |
Only the length changes between those sizes. Pitch, land pattern and row spacing stay put, so a footprint validated at 60 positions carries over at 80.
Allocate the returns before routing a signal. A workable split for a mixed interface is 18 to 20 grounds, leaving about 60 single-ended lines or roughly 30 differential pairs with an adjacent return each. Skip them and the longer contact path becomes crosstalk you cannot tune out later.
The contact housing shifts laterally inside the shell, so placement scatter, pad tolerance and bow across a 41 mm body land on the connector instead of your solder joints. That is the point of the part.
Three things it does not do. It does not absorb error in Z, so a stack that is too tall or too short bottoms out the contacts or removes their wipe. It does not retain the mated pair, so screws or a frame still carry pull on the top board. And it costs about 40 mΩ per contact against a fixed socket.
Gold is applied selectively. The contact area carries the full 3 µin over a 50 µin nickel underplate; the solder tails get a gold flash only.
Above roughly 5 µin on a tail, gold dissolves into the solder and grows brittle intermetallics that crack under thermal cycling, so more gold there makes the joint worse. Fix paste volume and pad geometry instead.
How often it gets mated | Finish worth paying for | Why |
|---|---|---|
Once, in the factory | Gold flash | No wear to budget for |
Field service across the product life | 3 µin (this part) | Tens of cycles, and it keeps fretting corrosion off the contact |
Test fixture, cycled daily | 10 to 15 µin | Wear, not corrosion, becomes the limit |
Harsh environment plus frequent service | 30 µin | Thick enough to survive repeated wipe |
Treat the cycle figures as rules of thumb.
Contact resistance is 120 mΩ maximum, against 80 mΩ on a fixed socket at this pitch. Ratings are 0.5 A and 50 V per contact.
Rail | Current | One-way drop | Out and back | Verdict |
|---|---|---|---|---|
3.3 V control | 50 mA | 6 mV | 12 mV | Ignore it |
1.8 V I/O | 100 mA | 12 mV | 24 mV | Comfortable |
1.0 V core or precision analog | 250 mA | 30 mV | 60 mV | Budget it, do not share with a power net |
At the full 0.5 A rating the drop is 60 mV one way, and 80 contacts loaded that heavily would dissipate around 2.4 W inside a 41 mm plastic body. Power belongs on its own connector. The envelope is -40 to +125 °C, where the LCP body under load sets the limit first.
Uneven paste tilts the housing and spends part of your float allowance before the boards meet. Keep the end and ground pads on the same deposit as the signal pads; enlarging them is what causes the tilt.
The locating posts stand 0.46 mm proud and register the part during placement. They are not retention, and an interference fit on those holes lifts the body off the pads. Size them to clear.
LCP takes a standard lead-free profile; a wave would put the housing and the floating mechanism into direct contact with solder. For rework, pull the plug first, use hot air or IR, and support the board while the paste is liquid.
An 8.30 mm body is taller than most 0.80 mm pitch parts your line handles, so confirm tape pocket depth and the feeder height limit early.
Two boards 11.75 mm apart, 80 positions with 18 grounds, leaving about 30 differential pairs for a four-lane camera interface plus control. The camera holder registered to the enclosure rather than the PCB, so 0.4 mm of stack-up had nowhere to go but the connector.
The aluminium housing doubles as the heatsink and the upper board runs about 25 °C hotter than the host. A fixed socket handed that growth straight to the solder joints; the floating body took it instead, and cracked-joint failures dropped to zero across a 2,000-unit run.
Service techs seat the board by hand, with no jig and at an angle. The float forgives it, and the 3 µin finish has passed 20 service cycles on units in the field three years.
Your gap is 9 mm or less. Take the 4.90 mm body.
Your gap sits between 9.00 and 9.75 mm. Neither standard body covers it; you need a spacer or a modified housing.
You want the connector to hold the boards together. There is no latch here.
You are carrying power or a precision analog reference. A fixed socket gives you 40 mΩ less per contact.
The boards are aligned by a jig and mated once. You would pay for movement you never use.
Plating thickness is verified against the ordered finish, contact resistance is sampled, solder-tail coplanarity is inspected, and mating height is confirmed against the real plug.
The 80-position build runs on tooling that already exists, so samples go out in days, not after a tooling programme. The matching plug, AAC8M080G2068R1, is stocked alongside it, so you can qualify the pair together.
Position counts across the same tooling, plating from flash to 30 µin, the 4.90 mm body height, and packing options. Send us your stack requirement and we will tell you whether an existing build covers it.
No. That is the plastic body height alone. Finished gaps are 9.75, 11.75 or 12.75 mm depending on the plug body.
At 0.5 A per contact you can, but the 120 mΩ path makes it a poor trade. Give power its own connector.
Around 18 to 20 of the 80 for a mixed interface. Every high-speed pair wants an adjacent return, and on a floating body the penalty is worse.
No. Reflow only, and remove the plug before any rework.
Neither standard body hits it: the short one tops out at 9.00 mm and this one starts at 9.75 mm. Ask us about a spacer.
No, but qualifying the pair together beats finding a wipe or height problem at the first build. We stock the matching plug for that reason.
