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Card Edge Connector
Industrial, IT Datacom
DDR4 is not the newest memory standard — and that is exactly why it is still the safest one to build on. The ecosystem is mature, costs are settled, and servers, storage, and industrial controllers running DDR4 will keep buying for years. What varies is the quality of the socket they plug into.
This connector is a 288-position DDR4 DIMM slot with a through-hole (DIP) solder tail at 2.5mm pitch, molded in PA66 + 30% glass fiber with a UL94V-2 rating. It ships in two finishes — G/F (flash gold) on a dark-blue housing with a white ejector, and 30u" gold on a black housing with a white ejector — so you can match gold thickness to your reliability budget without switching suppliers.
Part Number | Housing | Ejector | Contact Finish | Best Fit |
|---|---|---|---|---|
BR28802A2F5CR | Dark Blue | White | G/F (flash gold) contact area; 80u" matte tin solder tails | Cost-sensitive, single-insertion builds |
BR28802G2K1CR | Black | White | 30u" gold contact area; 80u" matte tin solder tails | Cycled, vibrated, or humid environments |
Both parts share the same mold, the same 133.35mm key location, the same pinout, and the same PA66 + 30% GF body. On your side, that means one qualification and two part numbers: the same PCB layout and the same assembly line run either finish. When your demand mix shifts, you order the other finish from the same supplier — no re-qualification.
A memory socket earns its keep at the solder joint, which takes the mechanical abuse. DIMMs get inserted, removed, re-seated, and occasionally levered out by someone in a hurry. A surface-mount socket relies on pad adhesion alone for that; a through-hole joint wraps solder around the tail and locks it to the barrel of the plated hole. For a 288-pin part with a module insertion force up to 106.8N, that anchor is the difference between a field return and a non-event.
The 2.5mm tail length is chosen so the joint fills the plated through-hole completely while keeping the tail short enough to avoid solder shadowing under the body. You get a visibly stronger joint on the same wave line you already run — no reflow tuning, no stencil redesign, and hand repair stays practical.
The housing and ejector are molded in glass-reinforced PA66, rated UL94V-2. Two properties matter on the line and in the field:
Heat. PA66 takes the 260°C wave dip without softening or letting solder wick up the pins. The glass fill keeps the long 133mm body from bowing as it cools, which protects tail coplanarity where the pins meet the board.
Stiffness. 288 pins in a row apply asymmetric stress when a module goes in at an angle. Glass-reinforced molding keeps the slot walls from flexing, so the latch still engages at the same height after years of insertions.
The white ejector is a separate molded component — also PA66 + 30% GF — so it flexes through its full opening travel without cracking the main housing. The color doubles as a quick visual check: if the ejector is open, you can see it from across the bench.
Gold thickness is the one spec most buyers skip and the one most field failures trace back to. Gold on the contact area is a wear-and-corrosion budget, not a luxury:
Keeps initial contact resistance low at a fraction of the cost — the right call where the module is inserted once and left alone: consumer boards, appliances, and most industrial boxes.
Roughly ten times the gold thickness, for connections that are cycled, vibrated, or exposed to humidity and sulfur — servers, telecom, rugged industrial. The thicker gold survives repeated wipes without exposing the nickel underplate, the point where contact resistance creeps up.
Both finishes carry 30u" minimum nickel underplating and 80u" matte tin solder tails, so solderability is identical. The only variable you pay for is the gold on the contact surface — match it to your field conditions.
No need to memorize the numbers — here is what they mean for your product:
Module insertion force 106.8N max — a standard DIMM insertion stays within comfortable limits for both operators and automation.
Extraction force 14.0gf min per pin pair — high enough that vibration will not loosen a seated module; low enough that field upgrades never fight the socket.
25 durability cycles — matched to DDR4's realistic service life, with margin for one or two field upgrades.
50Ω impedance; contact resistance 30mΩ max initial, ΔR 15mΩ max — controlled geometry keeps signal integrity inside DDR4's expectations, and the ΔR limit means the contact will not drift after thermal cycling.
Rated 1.2V±0.1V, 0.75A per pin — sized to DDR4's actual power envelope. No derating headaches in 1.2V designs.
Insulation 500V DC ≥1MΩ; dielectric 500V AC, no breakdown — headroom far beyond DDR4 signaling levels, which is what you want in industrial designs near mains power.
Run your product through this flow:
Inserted once, sealed enclosure, consumer or light industrial → G/F. Keep the cost.
Cycled more than a few times a year, or any exposure to humidity, dust, or sulfur → 30u".
Server or telecom with 5+ year MTBF targets and field memory swaps → 30u". The price delta between the two parts is a rounding error against a single field return.
Prototyping or qualification phase → order both. They share one footprint, so you can A/B the finish on the same board and decide with data instead of assumptions.
Servers and storage — the 30u" version for DIMM slots that see memory swaps during the machine's life; the 1.2V / 0.75A-per-pin rating aligns with standard RDIMM power.
Industrial PCs and controllers — the PA66 body and through-hole joints shrug off the vibration and temperature swings of a factory floor; the G/F version keeps cost targets in line.
Networking and telecom — 50Ω controlled impedance and the mechanical stability of a DIP joint suit line cards that stay powered for years.
Test and measurement fixtures — high-cycle environments where the 30u" finish earns its keep, and the white ejector gives a clear visual state indication during manual handling.
CONSHARE is a precision interconnect manufacturer, not a trading house — the housing, ejector, and contact assemblies are produced under our own process control. What that means in practice:
Plating thickness, insertion force, and contact resistance are checked against approved specification limits per lot, with records kept for traceability.
Tray packing at 60 pcs/tray and 600 pcs per carton (355 × 280 × 300mm) means parts arrive production-ready and the carton fits standard storage — no re-packing at your dock.
Housing and ejector color options, a logo-free mold for OEMs who brand their own boards, and PA material variants (PA46 / PA66 / PA9T) are available on the same tooling. RoHS and halogen-free options are part of the ordering code, not an afterthought.
Yes. Both finishes share the identical body, pinout, and 2.5mm DIP footprint. One qualification covers both parts.
Initial contact resistance is similar; the difference shows over time and cycles. G/F suits single-insertion products; 30u" gold is for repeated cycling, vibration, or humidity. Both use the same 80u" tin solder tails.
It is specified for wave soldering at 260±5°C with up to 10 seconds immersion. The through-hole tails also make selective soldering and hand repair practical — an advantage of DIP over SMT.
The mold supports multiple housing and ejector colors per the ordering code, and the logo-free version is standard. For custom requests, contact CONSHARE with your volume — the tooling can run PA46 / PA66 / PA9T variants.
