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Card Edge Connector
Industrial, IT Datacom
The MCIO (Mini Cool Edge IO) 38-position connector represents a significant advancement in high-density interconnect technology, engineered specifically for next-generation data infrastructure requiring PCIe Gen 5 signal integrity. This vertical SMT connector delivers 38 contacts at a compact 0.60mm pitch, supporting the 32GT/s data rates demanded by modern server, storage, and high-performance computing environments.
Designed in accordance with the SNIA SFF-TA-1016 standard, this connector provides a future-ready solution for system architects and hardware engineers who need reliable high-speed signal transmission within increasingly constrained PCB real estate. CONSHARE offers this interconnect solution for applications where board space optimization cannot compromise electrical performance.
At 32GT/s, signal degradation becomes a critical design concern. This connector’s 85Ω differential impedance design is specifically tuned to maintain signal fidelity at PCIe Gen 5 frequencies. The dual-row, 19-position-per-row configuration provides optimal signal-to-ground ratio, minimizing crosstalk and insertion loss that would otherwise force system designers to implement costly signal redrivers or reduce trace lengths.
The vertical (V/T) mounting orientation offers distinct advantages over right-angle alternatives in certain system architectures. When PCB real estate is at a premium on the horizontal plane, vertical mounting allows connectors to be placed in areas where board space is limited while maintaining clean, short signal paths to critical components. This is particularly valuable in dense server blade designs and compact networking equipment where every square millimeter counts.
All SMT tails are designed for reliable solder joint formation and long-term mechanical stability. The connector incorporates multiple PCB retention features that provide robust anchoring during both the soldering process and throughout the product’s operational life. The 1.20mm tail length specification ensures proper solder fillet formation across various PCB thicknesses while maintaining the low-profile footprint essential for modern system designs.
Rated for -40°C to +85°C operation, this connector is qualified for the thermal cycling demands of enterprise data centers, outdoor telecom equipment, and industrial environments where temperature fluctuations are a daily reality. The liquid crystal polymer (LCP) housing material provides excellent dimensional stability across this temperature range, ensuring consistent contact alignment and reliable mating/unmating cycles over the product’s service life.
MCIO connectors have become the interconnect of choice for PCIe Gen 5 storage subsystems. In NVMe SSD arrays, these connectors provide the high-density, high-speed links between storage devices and host controllers. The 38-position (4X lane) configuration is ideal for x4 PCIe connections commonly used in NVMe drives, offering a direct, low-loss path for the 32GT/s data stream.
Switches, routers, and network interface cards operating at 32GT/s require interconnects that can handle both the electrical demands of high-speed signaling and the mechanical demands of frequent field upgrades. This connector’s 200-cycle durability rating ensures reliable performance through multiple installation and maintenance cycles.
In HPC clusters where every nanosecond of latency matters, the signal integrity characteristics of the interconnect become as critical as the processor itself. The MCIO connector’s controlled impedance and low crosstalk design help system architects maintain signal margins in demanding parallel computing architectures.
Beyond cable applications, this connector serves as a reliable board-to-board interconnect solution. The vertical mounting configuration enables efficient stacking of PCBs within enclosures, providing high-density interconnections without the routing complexity that would otherwise consume multiple PCB layers.
The 38-position variant provides a 4-lane PCIe interface. For applications requiring 8-lane (74-position), 16-lane (124-position), or 20-lane (148-position) configurations, CONSHARE offers additional MCIO variants. The 38P is the optimal choice when:
Connecting a single NVMe SSD or x4 PCIe device
Board space is extremely constrained
System architecture uses multiple discrete x4 connections rather than aggregated wider links
Consideration | Vertical (This Product) | Right-Angle |
|---|---|---|
PCB space utilization | Minimal horizontal footprint | Extends along PCB surface |
Cable routing | Cable exits perpendicular to board | Cable runs parallel to board |
Best for | Stacked board designs, dense arrays | Edge connections, backplane applications |
The 1.20mm tail length supports standard PCB thicknesses commonly used in enterprise equipment. For non-standard board thicknesses, CONSHARE offers customization options for the soldering pin length to ensure proper mechanical and electrical connection.
This connector is designed for 85Ω differential impedance applications, which is the standard for most PCIe Gen 5 implementations. For applications requiring 100Ω impedance, CONSHARE provides alternative impedance-matched variants.
A: While specifically qualified for PCIe Gen 5 (32GT/s) operation, the connector’s electrical design provides headroom for future higher-speed protocols. Please consult CONSHARE for specific PCIe Gen 6 qualification status.
A: The connector is designed for surface-mount termination with a 0.60mm pitch. A Keep-Out Area is specified on the PCB layout to prevent routing or component placement that could interfere with connector installation. CONSHARE provides detailed PCB layout recommendations upon request.
A: Yes. The 0.60mm pitch design and 1.57mm PCB thickness compatibility make this connector suitable for PCIe riser card applications.
A: The LCP housing material supports IR reflow soldering processes with peak temperatures up to 260°C. This is compatible with standard lead-free solder processes.
A: Yes. This connector is available in tape-and-reel packaging suitable for automated pick-and-place assembly. Contact CONSHARE for specific packaging configurations.
A: The connector features gold plating on the contact area with a minimum thickness of 30 microinches (0.76μm). This ensures low contact resistance and excellent corrosion resistance over the product’s service life.
A: Yes. The MCIO connector system supports both cable termination and card-edge mating applications, providing flexibility in system design.
A: The connector provides minimum 10 MΩ insulation resistance between adjacent pins, ensuring reliable signal isolation in high-density layouts.
CONSHARE ensures all MCIO connectors meet rigorous quality standards. This product is RoHS compliant, manufactured with copper alloy contacts, and features a black LCP housing for durability and thermal stability. The connector is designed for 200 mating cycles minimum, providing reliable performance through the expected service life of enterprise equipment.
For technical support, PCB layout guidance, or custom configuration inquiries, contact the CONSHARE engineering team.
