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Card Edge Connector
Industrial, IT Datacom
A 98-position straddle-mount edge card connector built for PCIe Gen4 (16 GT/s) signal paths. 1.00 mm pitch, 1.57 mm card slot, dual-row A/B contacts, 15 µ" gold over nickel on the contact face, matte tin on the solder side. The LCP housing takes 50 mating cycles and -25 °C to +85 °C operating swings without flexing under the daughter card.
If you are designing a backplane, a riser, a fabric switch, or a sub-assembly where a daughter card has to plug into a mid-plane and survive 50 insertions in the field, this is the part you spec. CONSHARE builds it in a straddle-mount, without-guide-post package that drops into card cages a full-length guide frame cannot fit.
Three buyer profiles come in for this connector, each with a different concern.
Industrial PC and edge compute builders. The 1.57 mm card slot matches standard 1.6 mm FR-4, so the daughter card stays a low-cost four-layer board. The straddle-mount footprint also frees both host PCB faces for components, which is the difference between a two-side and a four-side assembly on a tight SBC.
Switch and router OEMs running a riser interface. Without guide posts, the part fits into 25 mm or 30 mm bays where a full guide frame would crowd the chassis. The 50-cycle rating is plenty for a line card that gets swapped once or twice a year.
Test fixture and backplane simulator houses. The 1.1 A per-pin current rating handles bench-level signal taps and a few hundred mA of sideband power, and the 30 mΩ contact ceiling keeps insertion loss low enough to characterize a Gen4 link at 16 GT/s without a calibration drift.
If any of those setups match yours, the rest of this page is for the questions you are going to ask.
Edge card connectors in this class look nearly identical until you put the numbers side by side. These three decide whether the part is right for your build.
Decision Point | What to Check | Why It Matters |
|---|---|---|
Card thickness | 1.57 mm slot, ±0.10 mm tolerance | Outside 1.47–1.67 mm the card will bottom out or float on the contacts |
PCB footprint | 0.70 ± 0.05 mm pads on 1.00 mm pitch | Mismatched pad layout will tilt the contact wipe and push contact resistance past 30 mΩ |
Plating thickness | 15 µ" gold over 30 µ" nickel underplate | The 15 µ" option is the cost-efficient choice for 50-cycle builds; step up to 30 µ" or 50 µ" only for harsher vapor exposure |
If those three line up with your build, the rest of the spec is standard Gen4 territory and you can move on to sourcing.
Three dimensions tend to confuse first-time specifiers. Here is what they actually mean in production.
The 56.00 ± 0.35 mm figure is the housing length, not the contact pattern. The active contact pattern itself is 39.15 mm with a 12.15 mm primary key and a 1.90 ± 0.06 mm alignment slot. Miss the key notch on the card edge and the part will not polarize, and you will chase field returns.
This is the height above the host PCB, not above the daughter card. If you are laying out a card cage, give yourself a 4.0 mm keep-out for the board-lock prong and the coplanarity tolerance of the solder tails.
The prong length decides how deep the daughter card sits when mated, which sets the keep-out under the host board. The 1.57 mm prong thickness is plating tolerance, not something you have to design around.
If you do not want to redraw the PCB layout by hand, request the CAD reference. CONSHARE provides the 0.70 ± 0.05 mm pad and 1.00 mm pitch pattern as a DXF, so you can drop it straight into your stack-up.
Parameter | Value | What It Means for Your Build |
|---|---|---|
Contact resistance | 30 mΩ max | Holds insertion loss inside the Gen4 channel budget at 16 GT/s |
Insulation resistance | 1000 MΩ min | Safe margin for low-leakage sideband signals and reset lines |
Dielectric strength | 500 V DC for 1 min | Withstands 12 V backplane fault transients without arcing |
Current rating | 1.1 A per pin min | Enough for auxiliary power, fan control, and sideband management |
Insertion force | 1.15 N per contact pair max | A 98-pin mating pulls under 60 N, well inside hand-mate limits |
Extraction force | 0.15 N per contact pair min | Card stays seated under shipping vibration, releases without tools |
Durability | 50 cycles | Matches a service-friendly card that gets swapped once or twice a year |
Operating temperature | -25 °C to +85 °C | Covers outdoor enclosures, industrial cabinets, telecom bays |
The plating stack is gold in the contact area, 80 µ" minimum matte tin on the solder tails, 30 µ" minimum nickel underplate over the whole terminal. The nickel barrier matters more than most buyers realize. Without it, copper migrates into the gold over time and contact resistance creeps past the 30 mΩ ceiling. CONSHARE plates nickel first, then gold, then tin, in that order, on every lot — not in the order some offshore brokers do to save bath time.
A part number tells you what you are buying. What it does not tell you is how it is built and what happens when something goes wrong. Three things you get from CONSHARE on this part number family that you do not get from a commodity broker.
Every batch of contacts goes through XRF thickness check before assembly. Plating certificates ship with the lot on request, which matters for medical, rail, and aerospace builds where the audit trail is part of the deliverable.
Stocked plating options (Flash, 15 µ", 30 µ", 50 µ" gold) ship inside two weeks. Custom plating (100 µ" gold, halogen-free compound, special housing color) runs four to six weeks with a written schedule at order acceptance.
The housing is shared across the family, so pin count variants, keying changes, color changes, and packaging options (tray or carton) are configurable on the same tool. You are not paying for a new mold to change the housing color or to drop a position.
If you need a RoHS-only, halogen-free, or CP-compliant variant, the part number is built for that. The plating code (A through G) covers every common contact plating spec from flash to 100 µ" gold. The environment code (B / C / H) selects RoHS, CP, or halogen-free. The packing code (C / E) switches between tray and carton box.
Configurations where this part has been qualified in the field. Not endorsements — just the setups buyers tell us worked first time.
Daughter card is 1.6 mm FR-4, four-layer, 1 oz copper. The 15 µ" gold variant has been in production for three years with zero DOA at customer incoming inspection. The board-lock prongs hold the card through 5 Grms vibration without a separate screw.
The 1.57 mm card edge is gold-plated on the contact side only. The 50-cycle rating covers a switch that gets a new line card once every 18 months. The straddle-mount footprint leaves both host PCB faces free for the switch ASICs.
The 30 mΩ contact ceiling keeps the analyzer's reference channel inside its calibration window. The 1.1 A per-pin current rating powers the analyzer's onboard regulators through the same edge card, so no separate power pigtail is needed.
No. This is a 98-position edge card connector, not a 164-position x16 CEM slot. It is built for custom daughter cards on 1.00 mm pitch. Use a CEM-compliant slot for a standard add-in card.
For most indoor telecom and industrial builds, yes. For condensing humidity, marine air, or sulfur-bearing atmospheres, step up to 30 µ" or 50 µ" gold. The nickel underplate is the same in every variant, so the difference is the gold thickness itself.
The matte tin solder tails are compatible with standard lead-free reflow. Peak body temperature 245 °C to 260 °C, 60 seconds above 217 °C. Wave soldering is not recommended for this part because of the straddle-mount geometry — the solder tails on both sides of the card edge will shadow each other.
The part number family is built on a shared housing platform. Pin count, keying, and color changes go through the same engineering review and do not need a new mold. Send your drawing to CONSHARE engineering and you get a part number back inside two business days.
For stocked plating, the MOQ is one tray. For custom plating or halogen-free material, the MOQ is one carton, scheduled into the next available production campaign.
